| Summary: | Heat rejection from electronic devices such as processors necessitates a high heat removal rate. The present study focuses on liquid-cooled novel heat sink geometry made from four channels (width 4 mm and depth 3.5 mm) configured in a concentric shape with alternate flow passages (slot of 3 mm gap). In this study, the cooling performance of the heat sink was tested under simulated controlled conditions.The lower bottom surface of the heat sink was heated at a constant heat flux condition based on dissipated power of 50 W and 70 W. The computations were carried out for different volume fractions of nanoparticles, namely 0.5% to 5%, and water as base fluid at a flow rate of 30 to 180 mL/min. The results showed a higher rate of heat rejection from the nanofluid cooled heat sink compared with water. The enhancement in performance was analyzed with the help of a temperature difference of nanofluid outlet temperature and water outlet temperature under similar operating conditions. The enhancement was ~2% for 0.5% volume fraction nanofluids and ~17% for a 5% volume fraction.
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