Thermal Performance Investigation of Slotted Fin Minichannel Heat Sink for Microprocessor Cooling
Due to high heat flux generation inside microprocessors, water-cooled heat sinks have gained special attention. For the durability of the microprocessor, this generated flux should be effectively removed. The effective thermal management of high-processing devices is now becoming popular due to high...
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| Format: | Article |
| Language: | English |
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MDPI AG
2021-10-01
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| Series: | Energies |
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| Online Access: | https://www.mdpi.com/1996-1073/14/19/6347 |
| _version_ | 1797516576116703232 |
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| author | Taha Baig Zabdur Rehman Hussain Ahmed Tariq Shehryar Manzoor Majid Ali Abdul Wadood Krzysztof Rajski Herie Park |
| author_facet | Taha Baig Zabdur Rehman Hussain Ahmed Tariq Shehryar Manzoor Majid Ali Abdul Wadood Krzysztof Rajski Herie Park |
| author_sort | Taha Baig |
| collection | DOAJ |
| description | Due to high heat flux generation inside microprocessors, water-cooled heat sinks have gained special attention. For the durability of the microprocessor, this generated flux should be effectively removed. The effective thermal management of high-processing devices is now becoming popular due to high heat flux generation. Heat removal plays a significant role in the longer operation and better performance of heat sinks. In this work, to tackle the heat generation issues, a slotted fin minichannel heat sink (SFMCHS) was investigated by modifying a conventional straight integral fin minichannel heat sink (SIFMCHS). SFMCHSs with fin spacings of 0.5 mm, 1 mm, and 1.5 mm were numerically studied. The numerical results were then compared with SIFMCHSs present in the literature. The base temperatures recorded for two slots per fin minichannel heat sink (SPFMCHS), with 0.5 mm, 1 mm, and 1.5 mm fin spacings, were 42.81 °C, 46.36 °C, and 48.86 °C, respectively, at 1 LPM. The reductions in base temperature achieved with two SPFMCHSs were 9.20%, 8.74%, and 7.39% for 0.5 mm, 1 mm, and 1.5 mm fin spacings, respectively, as compared to SIFMCHSs reported in the literature. The reductions in base temperature noted for three SPFMCHSs were 8.53%, 9.05%, and 5.95% for 0.5 mm, 1 mm, and 1.5 mm fin spacings, respectively, at 1 LPM, as compared to SIFMCHSs reported in the literature. In terms of heat transfer performance, the base temperature and thermal resistance of the 0.5 mm-spaced SPFMCHS is better compared to 1 mm and 1.5 mm fin spacings. The uniform temperature distribution at the base of the heat sink was observed in all cases solved in current work. |
| first_indexed | 2024-03-10T07:02:50Z |
| format | Article |
| id | doaj.art-6359d4ddbe9d497a902abfaac7b3e18c |
| institution | Directory Open Access Journal |
| issn | 1996-1073 |
| language | English |
| last_indexed | 2024-03-10T07:02:50Z |
| publishDate | 2021-10-01 |
| publisher | MDPI AG |
| record_format | Article |
| series | Energies |
| spelling | doaj.art-6359d4ddbe9d497a902abfaac7b3e18c2023-11-22T16:03:01ZengMDPI AGEnergies1996-10732021-10-011419634710.3390/en14196347Thermal Performance Investigation of Slotted Fin Minichannel Heat Sink for Microprocessor CoolingTaha Baig0Zabdur Rehman1Hussain Ahmed Tariq2Shehryar Manzoor3Majid Ali4Abdul Wadood5Krzysztof Rajski6Herie Park7Department of Mechanical Engineering, Wah Engineering College, University of Wah, Wah Cantt 47040, PakistanDepartment of Mechanical Engineering, Air University Islamabad, Aerospace and Aviation Campus, Kamra 43570, PakistanDepartment of Mechanical Engineering, Institute of Space Technology, Islamabad 44000, PakistanDepartment of Mechanical Engineering, University of Engineering and Technology Taxila, Taxila 47080, PakistanDepartment of Mechanical Engineering, Wah Engineering College, University of Wah, Wah Cantt 47040, PakistanDepartment of Electrical Engineering, Air University Islamabad, Aerospace and Aviation Campus, Kamra 43570, PakistanFaculty of Environmental Engineering, Wroclaw University of Science and Technology, 50-370 Wrocław, PolandDepartment of Electrical Engineering, Dong-A University, Busan 49315, KoreaDue to high heat flux generation inside microprocessors, water-cooled heat sinks have gained special attention. For the durability of the microprocessor, this generated flux should be effectively removed. The effective thermal management of high-processing devices is now becoming popular due to high heat flux generation. Heat removal plays a significant role in the longer operation and better performance of heat sinks. In this work, to tackle the heat generation issues, a slotted fin minichannel heat sink (SFMCHS) was investigated by modifying a conventional straight integral fin minichannel heat sink (SIFMCHS). SFMCHSs with fin spacings of 0.5 mm, 1 mm, and 1.5 mm were numerically studied. The numerical results were then compared with SIFMCHSs present in the literature. The base temperatures recorded for two slots per fin minichannel heat sink (SPFMCHS), with 0.5 mm, 1 mm, and 1.5 mm fin spacings, were 42.81 °C, 46.36 °C, and 48.86 °C, respectively, at 1 LPM. The reductions in base temperature achieved with two SPFMCHSs were 9.20%, 8.74%, and 7.39% for 0.5 mm, 1 mm, and 1.5 mm fin spacings, respectively, as compared to SIFMCHSs reported in the literature. The reductions in base temperature noted for three SPFMCHSs were 8.53%, 9.05%, and 5.95% for 0.5 mm, 1 mm, and 1.5 mm fin spacings, respectively, at 1 LPM, as compared to SIFMCHSs reported in the literature. In terms of heat transfer performance, the base temperature and thermal resistance of the 0.5 mm-spaced SPFMCHS is better compared to 1 mm and 1.5 mm fin spacings. The uniform temperature distribution at the base of the heat sink was observed in all cases solved in current work.https://www.mdpi.com/1996-1073/14/19/6347slotted fin minichannel heat sinkbase temperaturethermal managementnumerical simulation |
| spellingShingle | Taha Baig Zabdur Rehman Hussain Ahmed Tariq Shehryar Manzoor Majid Ali Abdul Wadood Krzysztof Rajski Herie Park Thermal Performance Investigation of Slotted Fin Minichannel Heat Sink for Microprocessor Cooling Energies slotted fin minichannel heat sink base temperature thermal management numerical simulation |
| title | Thermal Performance Investigation of Slotted Fin Minichannel Heat Sink for Microprocessor Cooling |
| title_full | Thermal Performance Investigation of Slotted Fin Minichannel Heat Sink for Microprocessor Cooling |
| title_fullStr | Thermal Performance Investigation of Slotted Fin Minichannel Heat Sink for Microprocessor Cooling |
| title_full_unstemmed | Thermal Performance Investigation of Slotted Fin Minichannel Heat Sink for Microprocessor Cooling |
| title_short | Thermal Performance Investigation of Slotted Fin Minichannel Heat Sink for Microprocessor Cooling |
| title_sort | thermal performance investigation of slotted fin minichannel heat sink for microprocessor cooling |
| topic | slotted fin minichannel heat sink base temperature thermal management numerical simulation |
| url | https://www.mdpi.com/1996-1073/14/19/6347 |
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