Evaluation of Solder Joint Reliability in 3D Packaging Memory Devices under Thermal Shock
In 3D packaging memory devices, solder joints are critical links between the chip and the printed circuit board (PCB). Under severe working conditions, cracks inevitably occur due to thermal shock. If cracks grow in the solder joint, the chip will be disconnected with the PCB, causing its function f...
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| Format: | Article |
| Language: | English |
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MDPI AG
2022-08-01
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| Series: | Electronics |
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| Online Access: | https://www.mdpi.com/2079-9292/11/16/2556 |
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| author | Shuai Zhou Zhenpei Lin Baojun Qiu Han Wang Jingang Xiong Chang He Bei Zhou Yiliang Pan Renbin Huang Yiliang Bao Nian Cai |
| author_facet | Shuai Zhou Zhenpei Lin Baojun Qiu Han Wang Jingang Xiong Chang He Bei Zhou Yiliang Pan Renbin Huang Yiliang Bao Nian Cai |
| author_sort | Shuai Zhou |
| collection | DOAJ |
| description | In 3D packaging memory devices, solder joints are critical links between the chip and the printed circuit board (PCB). Under severe working conditions, cracks inevitably occur due to thermal shock. If cracks grow in the solder joint, the chip will be disconnected with the PCB, causing its function failure. In this paper, the reliability of solder joints under thermal shock are evaluated for 3D packaging memory devices by means of the SEM and finite element analysis. As microscopically studied by the SEM, it is found out that the main failure mechanism of solder joints in such test is the thermal fatigue failure of solder joints. Finite element analysis shows that cracks are caused by the accumulation of plastic work and creep strain. The initiation and growth of cracks are mainly influenced by the inelastic strain accumulation. The trends of cracks are influenced by the difference between the coefficient of thermal expansion (CTE) of epoxy resin and that of the chip. |
| first_indexed | 2024-03-09T13:32:09Z |
| format | Article |
| id | doaj.art-63fb9ec2afc04275b5b847c702c64628 |
| institution | Directory Open Access Journal |
| issn | 2079-9292 |
| language | English |
| last_indexed | 2024-03-09T13:32:09Z |
| publishDate | 2022-08-01 |
| publisher | MDPI AG |
| record_format | Article |
| series | Electronics |
| spelling | doaj.art-63fb9ec2afc04275b5b847c702c646282023-11-30T21:16:43ZengMDPI AGElectronics2079-92922022-08-011116255610.3390/electronics11162556Evaluation of Solder Joint Reliability in 3D Packaging Memory Devices under Thermal ShockShuai Zhou0Zhenpei Lin1Baojun Qiu2Han Wang3Jingang Xiong4Chang He5Bei Zhou6Yiliang Pan7Renbin Huang8Yiliang Bao9Nian Cai10School of Microelectronics, Tianjin University, Tianjin 300072, ChinaThe State Key Laboratory of Precision Electronic Manufacturing Technology and Equipment, Guangdong University of Technology, Guangzhou 510006, ChinaChina Electronic Product Reliability and Environmental Testing Research Institute, Guangzhou 510006, ChinaThe State Key Laboratory of Precision Electronic Manufacturing Technology and Equipment, Guangdong University of Technology, Guangzhou 510006, ChinaThe State Key Laboratory of Precision Electronic Manufacturing Technology and Equipment, Guangdong University of Technology, Guangzhou 510006, ChinaThe State Key Laboratory of Precision Electronic Manufacturing Technology and Equipment, Guangdong University of Technology, Guangzhou 510006, ChinaThe State Key Laboratory of Precision Electronic Manufacturing Technology and Equipment, Guangdong University of Technology, Guangzhou 510006, ChinaThe State Key Laboratory of Precision Electronic Manufacturing Technology and Equipment, Guangdong University of Technology, Guangzhou 510006, ChinaThe State Key Laboratory of Precision Electronic Manufacturing Technology and Equipment, Guangdong University of Technology, Guangzhou 510006, ChinaThe State Key Laboratory of Precision Electronic Manufacturing Technology and Equipment, Guangdong University of Technology, Guangzhou 510006, ChinaThe State Key Laboratory of Precision Electronic Manufacturing Technology and Equipment, Guangdong University of Technology, Guangzhou 510006, ChinaIn 3D packaging memory devices, solder joints are critical links between the chip and the printed circuit board (PCB). Under severe working conditions, cracks inevitably occur due to thermal shock. If cracks grow in the solder joint, the chip will be disconnected with the PCB, causing its function failure. In this paper, the reliability of solder joints under thermal shock are evaluated for 3D packaging memory devices by means of the SEM and finite element analysis. As microscopically studied by the SEM, it is found out that the main failure mechanism of solder joints in such test is the thermal fatigue failure of solder joints. Finite element analysis shows that cracks are caused by the accumulation of plastic work and creep strain. The initiation and growth of cracks are mainly influenced by the inelastic strain accumulation. The trends of cracks are influenced by the difference between the coefficient of thermal expansion (CTE) of epoxy resin and that of the chip.https://www.mdpi.com/2079-9292/11/16/25563D packaging memory devicethermal shock testreliabilityfinite element analysis |
| spellingShingle | Shuai Zhou Zhenpei Lin Baojun Qiu Han Wang Jingang Xiong Chang He Bei Zhou Yiliang Pan Renbin Huang Yiliang Bao Nian Cai Evaluation of Solder Joint Reliability in 3D Packaging Memory Devices under Thermal Shock Electronics 3D packaging memory device thermal shock test reliability finite element analysis |
| title | Evaluation of Solder Joint Reliability in 3D Packaging Memory Devices under Thermal Shock |
| title_full | Evaluation of Solder Joint Reliability in 3D Packaging Memory Devices under Thermal Shock |
| title_fullStr | Evaluation of Solder Joint Reliability in 3D Packaging Memory Devices under Thermal Shock |
| title_full_unstemmed | Evaluation of Solder Joint Reliability in 3D Packaging Memory Devices under Thermal Shock |
| title_short | Evaluation of Solder Joint Reliability in 3D Packaging Memory Devices under Thermal Shock |
| title_sort | evaluation of solder joint reliability in 3d packaging memory devices under thermal shock |
| topic | 3D packaging memory device thermal shock test reliability finite element analysis |
| url | https://www.mdpi.com/2079-9292/11/16/2556 |
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