Evaluation of Solder Joint Reliability in 3D Packaging Memory Devices under Thermal Shock

Evaluation of Solder Joint Reliability in 3D Packaging Memory Devices under Thermal Shock

In 3D packaging memory devices, solder joints are critical links between the chip and the printed circuit board (PCB). Under severe working conditions, cracks inevitably occur due to thermal shock. If cracks grow in the solder joint, the chip will be disconnected with the PCB, causing its function f...

Full description

Bibliographic Details
Main Authors: Shuai Zhou, Zhenpei Lin, Baojun Qiu, Han Wang, Jingang Xiong, Chang He, Bei Zhou, Yiliang Pan, Renbin Huang, Yiliang Bao, Nian Cai
Format: Article
Language:English
Published: MDPI AG 2022-08-01
Series:Electronics
Subjects:
3D packaging memory device
thermal shock test
reliability
finite element analysis
Online Access:https://www.mdpi.com/2079-9292/11/16/2556

Similar Items

Similar Items