Combination of Micro-Corrugation Process and Pre-Stretched Method for Highly Stretchable Vertical Wavy Structured Metal Interconnects
Metal interconnects with a vertical wavy structure have been studied to realize high-density and low-electric-resistance stretchable interconnects. This study proposed a new method for fabricating vertical wavy structured metal interconnects that comprises the pre-stretch method and the micro-corrug...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
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MDPI AG
2022-07-01
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| Series: | Micromachines |
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| Online Access: | https://www.mdpi.com/2072-666X/13/8/1210 |
| _version_ | 1827599036505391104 |
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| author | Michitaka Yamamoto Shinji Okuda Seiichi Takamatsu Toshihiro Itoh |
| author_facet | Michitaka Yamamoto Shinji Okuda Seiichi Takamatsu Toshihiro Itoh |
| author_sort | Michitaka Yamamoto |
| collection | DOAJ |
| description | Metal interconnects with a vertical wavy structure have been studied to realize high-density and low-electric-resistance stretchable interconnects. This study proposed a new method for fabricating vertical wavy structured metal interconnects that comprises the pre-stretch method and the micro-corrugation process. The pre-stretch method is a conventional method in which a metal film is placed on a pre-stretched substrate, and a vertical wavy structure is formed using the return force of the substrate. The micro-corrugation process is a recent method in which a metal foil is bent vertically and continuously using micro-gears. In the proposed method, the pitch of the vertical wavy structured interconnect fabricated using the micro-corrugation process is significantly narrowed using the restoring force of the pre-stretched substrate, with stretchability improvement of up to 165%, which is significantly higher than that of conventional vertical wavy structured metal interconnects. The electrical resistance of the fabricated interconnect was low (120–160 mΩ) and stable (±2 mΩ or less) until breakage by strain. In addition, the fabricated interconnect exhibits durability of more than 6500 times in a 30% strain cycle test. |
| first_indexed | 2024-03-09T04:05:29Z |
| format | Article |
| id | doaj.art-643cc9d131ea490d9ef2458d0df5dbae |
| institution | Directory Open Access Journal |
| issn | 2072-666X |
| language | English |
| last_indexed | 2024-03-09T04:05:29Z |
| publishDate | 2022-07-01 |
| publisher | MDPI AG |
| record_format | Article |
| series | Micromachines |
| spelling | doaj.art-643cc9d131ea490d9ef2458d0df5dbae2023-12-03T14:07:45ZengMDPI AGMicromachines2072-666X2022-07-01138121010.3390/mi13081210Combination of Micro-Corrugation Process and Pre-Stretched Method for Highly Stretchable Vertical Wavy Structured Metal InterconnectsMichitaka Yamamoto0Shinji Okuda1Seiichi Takamatsu2Toshihiro Itoh3Department of Precision Engineering, Graduate School of Engineering, The University of Tokyo, 7-3-1 Hongo, Bunkyo-ku, Tokyo 113-8656, JapanDepartment of Human and Engineered Environmental Studies, Graduate School of Frontier Sciences, The University of Tokyo, Kashiwa 277-8563, JapanDepartment of Precision Engineering, Graduate School of Engineering, The University of Tokyo, 7-3-1 Hongo, Bunkyo-ku, Tokyo 113-8656, JapanDepartment of Precision Engineering, Graduate School of Engineering, The University of Tokyo, 7-3-1 Hongo, Bunkyo-ku, Tokyo 113-8656, JapanMetal interconnects with a vertical wavy structure have been studied to realize high-density and low-electric-resistance stretchable interconnects. This study proposed a new method for fabricating vertical wavy structured metal interconnects that comprises the pre-stretch method and the micro-corrugation process. The pre-stretch method is a conventional method in which a metal film is placed on a pre-stretched substrate, and a vertical wavy structure is formed using the return force of the substrate. The micro-corrugation process is a recent method in which a metal foil is bent vertically and continuously using micro-gears. In the proposed method, the pitch of the vertical wavy structured interconnect fabricated using the micro-corrugation process is significantly narrowed using the restoring force of the pre-stretched substrate, with stretchability improvement of up to 165%, which is significantly higher than that of conventional vertical wavy structured metal interconnects. The electrical resistance of the fabricated interconnect was low (120–160 mΩ) and stable (±2 mΩ or less) until breakage by strain. In addition, the fabricated interconnect exhibits durability of more than 6500 times in a 30% strain cycle test.https://www.mdpi.com/2072-666X/13/8/1210stretchable interconnectsCu foilmicro-corrugation processpre-stretch method |
| spellingShingle | Michitaka Yamamoto Shinji Okuda Seiichi Takamatsu Toshihiro Itoh Combination of Micro-Corrugation Process and Pre-Stretched Method for Highly Stretchable Vertical Wavy Structured Metal Interconnects Micromachines stretchable interconnects Cu foil micro-corrugation process pre-stretch method |
| title | Combination of Micro-Corrugation Process and Pre-Stretched Method for Highly Stretchable Vertical Wavy Structured Metal Interconnects |
| title_full | Combination of Micro-Corrugation Process and Pre-Stretched Method for Highly Stretchable Vertical Wavy Structured Metal Interconnects |
| title_fullStr | Combination of Micro-Corrugation Process and Pre-Stretched Method for Highly Stretchable Vertical Wavy Structured Metal Interconnects |
| title_full_unstemmed | Combination of Micro-Corrugation Process and Pre-Stretched Method for Highly Stretchable Vertical Wavy Structured Metal Interconnects |
| title_short | Combination of Micro-Corrugation Process and Pre-Stretched Method for Highly Stretchable Vertical Wavy Structured Metal Interconnects |
| title_sort | combination of micro corrugation process and pre stretched method for highly stretchable vertical wavy structured metal interconnects |
| topic | stretchable interconnects Cu foil micro-corrugation process pre-stretch method |
| url | https://www.mdpi.com/2072-666X/13/8/1210 |
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