The Fabrication and Indentation of Cubic Silicon Carbide Diaphragm for Acoustic Sensing

In this study, 550 nm thick cubic silicon carbide square diaphragms were back etched from Si substrate. Then, indentation was carried out to samples with varying dimensions, indentation locations, and loads. The influence of three parameters is documented by analyzing load-displacement curves. It wa...

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Main Authors: Siti Aisyah Zawawi, Azrul Azlan Hamzah, Burhanuddin Yeop Majlis, Faisal Mohd-Yasin
Format: Article
Language:English
Published: MDPI AG 2021-09-01
Series:Micromachines
Subjects:
Online Access:https://www.mdpi.com/2072-666X/12/9/1101
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author Siti Aisyah Zawawi
Azrul Azlan Hamzah
Burhanuddin Yeop Majlis
Faisal Mohd-Yasin
author_facet Siti Aisyah Zawawi
Azrul Azlan Hamzah
Burhanuddin Yeop Majlis
Faisal Mohd-Yasin
author_sort Siti Aisyah Zawawi
collection DOAJ
description In this study, 550 nm thick cubic silicon carbide square diaphragms were back etched from Si substrate. Then, indentation was carried out to samples with varying dimensions, indentation locations, and loads. The influence of three parameters is documented by analyzing load-displacement curves. It was found that diaphragms with bigger area, indented at the edge, and low load demonstrated almost elastic behaviour. Furthermore, two samples burst and one of them displayed pop-in behaviour, which we determine is due to plastic deformation. Based on optimum dimension and load, we calculate maximum pressure for elastic diaphragms. This pressure is sufficient for cubic silicon carbide diaphragms to be used as acoustic sensors to detect poisonous gasses.
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spelling doaj.art-64c4a5b083a241e49dd79002b22674ee2023-11-22T14:16:37ZengMDPI AGMicromachines2072-666X2021-09-01129110110.3390/mi12091101The Fabrication and Indentation of Cubic Silicon Carbide Diaphragm for Acoustic SensingSiti Aisyah Zawawi0Azrul Azlan Hamzah1Burhanuddin Yeop Majlis2Faisal Mohd-Yasin3Institute of Microengineering and Nanoelectronics, Universiti Kebangsaan Malaysia, Bangi 43600, Selangor, MalaysiaInstitute of Microengineering and Nanoelectronics, Universiti Kebangsaan Malaysia, Bangi 43600, Selangor, MalaysiaInstitute of Microengineering and Nanoelectronics, Universiti Kebangsaan Malaysia, Bangi 43600, Selangor, MalaysiaQueensland Micro- and Nanotechnology Centre, Griffith University, Nathan, QLD 4111, AustraliaIn this study, 550 nm thick cubic silicon carbide square diaphragms were back etched from Si substrate. Then, indentation was carried out to samples with varying dimensions, indentation locations, and loads. The influence of three parameters is documented by analyzing load-displacement curves. It was found that diaphragms with bigger area, indented at the edge, and low load demonstrated almost elastic behaviour. Furthermore, two samples burst and one of them displayed pop-in behaviour, which we determine is due to plastic deformation. Based on optimum dimension and load, we calculate maximum pressure for elastic diaphragms. This pressure is sufficient for cubic silicon carbide diaphragms to be used as acoustic sensors to detect poisonous gasses.https://www.mdpi.com/2072-666X/12/9/1101indentationsilicon carbidediaphragmload-displacement curvemicrophone
spellingShingle Siti Aisyah Zawawi
Azrul Azlan Hamzah
Burhanuddin Yeop Majlis
Faisal Mohd-Yasin
The Fabrication and Indentation of Cubic Silicon Carbide Diaphragm for Acoustic Sensing
Micromachines
indentation
silicon carbide
diaphragm
load-displacement curve
microphone
title The Fabrication and Indentation of Cubic Silicon Carbide Diaphragm for Acoustic Sensing
title_full The Fabrication and Indentation of Cubic Silicon Carbide Diaphragm for Acoustic Sensing
title_fullStr The Fabrication and Indentation of Cubic Silicon Carbide Diaphragm for Acoustic Sensing
title_full_unstemmed The Fabrication and Indentation of Cubic Silicon Carbide Diaphragm for Acoustic Sensing
title_short The Fabrication and Indentation of Cubic Silicon Carbide Diaphragm for Acoustic Sensing
title_sort fabrication and indentation of cubic silicon carbide diaphragm for acoustic sensing
topic indentation
silicon carbide
diaphragm
load-displacement curve
microphone
url https://www.mdpi.com/2072-666X/12/9/1101
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