Stress Analysis of Tungsten Deposition in a 3D Trench Mold With Regard to Initial Nuclei Shape
Tungsten has been commonly used for fine interconnects due to its good gap-filling characteristics in 3D molds, such as trench patterns. However, tungsten shows high deposition stress. This causes mold distortion because tungsten has low ad-atom mobility, and diffusion-driven relaxation does not occ...
| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
IEEE
2022-01-01
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| Series: | IEEE Access |
| Subjects: | |
| Online Access: | https://ieeexplore.ieee.org/document/9893796/ |