Stress Analysis of Tungsten Deposition in a 3D Trench Mold With Regard to Initial Nuclei Shape
Tungsten has been commonly used for fine interconnects due to its good gap-filling characteristics in 3D molds, such as trench patterns. However, tungsten shows high deposition stress. This causes mold distortion because tungsten has low ad-atom mobility, and diffusion-driven relaxation does not occ...
Main Authors: | Jong-Sung Lee, Suncheul Kim, Donghoon Han, Myoung-Gyu Lee, Young-Chang Joo |
---|---|
Format: | Article |
Language: | English |
Published: |
IEEE
2022-01-01
|
Series: | IEEE Access |
Subjects: | |
Online Access: | https://ieeexplore.ieee.org/document/9893796/ |
Similar Items
-
Effect of substrate and template on the development of nano tungsten and indium oxide thin films
by: Qonitatillah Mohammad Rofii, 1977-, et al.
Published: (2010) -
Effect of substrate and template on the development of nano tungsten and indium oxide thin films
by: Qonitatillah Mohammad Rofii, 1977-, et al.
Published: (2010) -
Electrophoretic deposition prepared yttria as interface of tungsten fiber reinforced tungsten composites
by: Y. Mao, et al.
Published: (2023-09-01) -
Chemical vapor deposition of tungsten and tungsten silicides : for VLSI/ULSI applications
by: 439284 Schmitz, John E. J.
Published: (1992) -
Geochemistry of apatite from Zhuxiling tungsten deposit, eastern China: A record of magma evolution and tungsten enrichment
by: Likai Ge, et al.
Published: (2024-03-01)