| Summary: | Analyses in the present work focus on understanding the influence of the WAAM (wire arc additive manufacturing) deposition pattern and travel speed on residual stress and warpage in aluminum alloy. The thermal profiles are analyzed using thermomechanical FE simulations. Analysis shows that the out–in deposition pattern leads to the highest level of residual stress and warpage. It is also found that an increase in the travel speed decreases the peak temperature and thermal gradient during the AM deposition, which results in a lower level of residual stress generation. A comparison of results for the line-type patterns (raster and alternate) suggests that the deposition interval between each deposition has little influence on thermal profiles, residual stress generation, and warpage. However, the contour-type patterns significantly affect the heat transfer, thermal gradient, and cooling rate during the AM deposition.
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