Fabrication of Carbon Fiber Reinforced Aromatic Polyamide Composites and Their Thermal Conductivities with a h-BN Filler
In this study, a carbon fiber-reinforced thermoplastic composite was fabricated using a new aromatic polyamide (APA) as a matrix. Non-isothermal crystallization behaviors in the cooling process of APA resin (a semi-crystalline polymer) and composite were analyzed by using a differential scanning cal...
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MDPI AG
2020-12-01
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| Series: | Polymers |
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| Online Access: | https://www.mdpi.com/2073-4360/13/1/21 |
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| author | Min Jun Lee Pil Gyu Lee Il-Joon Bae Jong Sung Won Min Hong Jeon Seung Goo Lee |
| author_facet | Min Jun Lee Pil Gyu Lee Il-Joon Bae Jong Sung Won Min Hong Jeon Seung Goo Lee |
| author_sort | Min Jun Lee |
| collection | DOAJ |
| description | In this study, a carbon fiber-reinforced thermoplastic composite was fabricated using a new aromatic polyamide (APA) as a matrix. Non-isothermal crystallization behaviors in the cooling process of APA resin (a semi-crystalline polymer) and composite were analyzed by using a differential scanning calorimeter (DSC). To determine the optimum molding conditions, processing parameters such as the molding temperature and time were varied during compression molding of the Carbon/APA composite. The tensile and flexural properties and morphologies of the fabricated composites were analyzed. Molding at 270 °C and 50 MPa for 5 min. showed relatively good mechanical properties and morphologies; thus, this condition was selected as the optimal molding condition. In addition, to enhance the thermal conductivity of the Carbon/APA composite, a study was conducted to add hexagonal boron nitride (h-BN) as a filler. The surface of h-BN was oxidized to increase its miscibility in the resin, which resulted in better dispersity in the APA matrix. In conclusion, a Carbon/APA (h-BN) composite manufactured under optimal molding conditions with an APA resin containing surface-treated h-BN showed a thermal conductivity more than twice that of the case without h-BN. |
| first_indexed | 2024-03-10T13:50:22Z |
| format | Article |
| id | doaj.art-67b1dffd71c049f1b34de711407f3bd9 |
| institution | Directory Open Access Journal |
| issn | 2073-4360 |
| language | English |
| last_indexed | 2024-03-10T13:50:22Z |
| publishDate | 2020-12-01 |
| publisher | MDPI AG |
| record_format | Article |
| series | Polymers |
| spelling | doaj.art-67b1dffd71c049f1b34de711407f3bd92023-11-21T02:14:25ZengMDPI AGPolymers2073-43602020-12-011312110.3390/polym13010021Fabrication of Carbon Fiber Reinforced Aromatic Polyamide Composites and Their Thermal Conductivities with a h-BN FillerMin Jun Lee0Pil Gyu Lee1Il-Joon Bae2Jong Sung Won3Min Hong Jeon4Seung Goo Lee5Department of Advanced Organic Materials & Textile Engineering, Chungnam National University, Daejeon 34134, KoreaDepartment of Advanced Organic Materials & Textile Engineering, Chungnam National University, Daejeon 34134, KoreaCarbon Fiber Thermal Textile Project Team, Research Institute of Industrial Science & Technology, Pohang 37673, KoreaRobert Frederick Smith school of Chemical and Biomolecular Engineering, Cornell University, Ithaca, NY 14853, USADepartment of Advanced Organic Materials & Textile Engineering, Chungnam National University, Daejeon 34134, KoreaDepartment of Advanced Organic Materials & Textile Engineering, Chungnam National University, Daejeon 34134, KoreaIn this study, a carbon fiber-reinforced thermoplastic composite was fabricated using a new aromatic polyamide (APA) as a matrix. Non-isothermal crystallization behaviors in the cooling process of APA resin (a semi-crystalline polymer) and composite were analyzed by using a differential scanning calorimeter (DSC). To determine the optimum molding conditions, processing parameters such as the molding temperature and time were varied during compression molding of the Carbon/APA composite. The tensile and flexural properties and morphologies of the fabricated composites were analyzed. Molding at 270 °C and 50 MPa for 5 min. showed relatively good mechanical properties and morphologies; thus, this condition was selected as the optimal molding condition. In addition, to enhance the thermal conductivity of the Carbon/APA composite, a study was conducted to add hexagonal boron nitride (h-BN) as a filler. The surface of h-BN was oxidized to increase its miscibility in the resin, which resulted in better dispersity in the APA matrix. In conclusion, a Carbon/APA (h-BN) composite manufactured under optimal molding conditions with an APA resin containing surface-treated h-BN showed a thermal conductivity more than twice that of the case without h-BN.https://www.mdpi.com/2073-4360/13/1/21aromatic polyamidecarbon fiberthermoplastic compositethermal conductivityboron nitride |
| spellingShingle | Min Jun Lee Pil Gyu Lee Il-Joon Bae Jong Sung Won Min Hong Jeon Seung Goo Lee Fabrication of Carbon Fiber Reinforced Aromatic Polyamide Composites and Their Thermal Conductivities with a h-BN Filler Polymers aromatic polyamide carbon fiber thermoplastic composite thermal conductivity boron nitride |
| title | Fabrication of Carbon Fiber Reinforced Aromatic Polyamide Composites and Their Thermal Conductivities with a h-BN Filler |
| title_full | Fabrication of Carbon Fiber Reinforced Aromatic Polyamide Composites and Their Thermal Conductivities with a h-BN Filler |
| title_fullStr | Fabrication of Carbon Fiber Reinforced Aromatic Polyamide Composites and Their Thermal Conductivities with a h-BN Filler |
| title_full_unstemmed | Fabrication of Carbon Fiber Reinforced Aromatic Polyamide Composites and Their Thermal Conductivities with a h-BN Filler |
| title_short | Fabrication of Carbon Fiber Reinforced Aromatic Polyamide Composites and Their Thermal Conductivities with a h-BN Filler |
| title_sort | fabrication of carbon fiber reinforced aromatic polyamide composites and their thermal conductivities with a h bn filler |
| topic | aromatic polyamide carbon fiber thermoplastic composite thermal conductivity boron nitride |
| url | https://www.mdpi.com/2073-4360/13/1/21 |
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