| Summary: | This work investigates the influence of an Ag nanoparticle addition on the microstructure, microhardness, creep, temperature-dependent elastic properties, damping capacity, and shear strength of an environmentally friendly eutectic Sn-9Zn (wt.%) material. A microstructure analysis confirmed that adding Ag nanoparticles significantly altered the morphologies of the Zn-rich phase, which includes the size and shape in the presence of fine spherical-shaped AgZn<sub>3</sub> intermetallic compound (IMC) particles in the β-Sn matrix. These fine microstructures positively impact on microhardness, creep, damping capacity, and temperature-dependent elastic properties. Furthermore, in the electronic interconnection on an Au/Ni-plated-Cu pad ball grid array (BGA) substrate, adding Ag nanoparticles generates an additional AgZn<sub>3</sub> IMC layer at the top surface of the AuZn<sub>3</sub> IMC layer. It also significantly improves the oxidation resistance of Sn-Zn material due to the formation of fine AgZn<sub>3</sub> IMC particles. Moreover, the interfacial shear strength value of the Sn-Zn material doped with Ag nanoparticles on the Au/Ni-Cu pad BGA substrate increased about 12% as compared to the reference material after five minutes of reaction in the presence of a fine Zn-rich phase and AgZn<sub>3</sub> IMC particles, which acted as second phase dispersion strengthening mechanism. Adding Ag nanoparticles also altered the fracture mode to a typical ductile failure with rough dimpled surfaces of the Sn-Zn material.
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