Low Loss W-Band Packaged Filtering Balun Based on a Modified Quarter-Mode Folded Substrate-Integrated Waveguide Cavity
A novel packaged filtering balun is proposed by modifying quarter-mode edge and diagonally folded SIW (FSIW) cavities. The TM<sub>220</sub> mode is selected to realize the differential signal conversion by using a quarter-mode diagonally FSIW. Furthermore, TM<sub>130</sub>, a...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
IEEE
2022-01-01
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| Series: | IEEE Access |
| Subjects: | |
| Online Access: | https://ieeexplore.ieee.org/document/9797715/ |
| Summary: | A novel packaged filtering balun is proposed by modifying quarter-mode edge and diagonally folded SIW (FSIW) cavities. The TM<sub>220</sub> mode is selected to realize the differential signal conversion by using a quarter-mode diagonally FSIW. Furthermore, TM<sub>130</sub>, and TM<sub>330</sub> modes are obtained by using a quarter-mode edge FSIW cavity by analyzing the mode field distributions. A W band packaged filtering balun is designed and simulated. Then, it is fabricated with 70 <inline-formula> <tex-math notation="LaTeX">$\mu {\mathrm{ m}}$ </tex-math></inline-formula> thickness per layer based on our in- house Si-based MEMS photosensitive film process. The size of the filtering balun is only <inline-formula> <tex-math notation="LaTeX">$2.83~\lambda \text{g}^{2}$ </tex-math></inline-formula> with insertion loss of 3 + 1.8 dB. These types of packaged filtering balun are very suitable for future 3D heterogeneous integration with other semiconductor devices. |
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| ISSN: | 2169-3536 |