Enhanced Heat Dissipation for Macroscopic Metals Achieved by a Single‐Layer Graphene
Abstract The increasing demand for high‐performance devices on heat dissipation makes it approach the bottleneck even for metals with high thermal conductivities. The coating of only one layer of graphene, the heat dissipation performances of Cu, Ag, and Al can be further enhanced, e.g., with a maxi...
| Main Authors: | , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Wiley-VCH
2024-04-01
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| Series: | Advanced Materials Interfaces |
| Subjects: | |
| Online Access: | https://doi.org/10.1002/admi.202300877 |
| _version_ | 1797208358797705216 |
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| author | Jiayuan Fang Xujun Xu Yang Zhang Qiancheng Ren Ning Wei Pei Zhao |
| author_facet | Jiayuan Fang Xujun Xu Yang Zhang Qiancheng Ren Ning Wei Pei Zhao |
| author_sort | Jiayuan Fang |
| collection | DOAJ |
| description | Abstract The increasing demand for high‐performance devices on heat dissipation makes it approach the bottleneck even for metals with high thermal conductivities. The coating of only one layer of graphene, the heat dissipation performances of Cu, Ag, and Al can be further enhanced, e.g., with a maximum temperature reduction by ≈9% for a Cu foil is demonstrated. Molecular dynamics (MD) analysis of spectral phonon transmission reveals that low‐frequency phonons play a significant role in the thermal transport within the Cu/single‐layer graphene (SLG) system, and the high‐frequency phonons exhibit substantial mismatch. It suggests that the thermal anisotropy of graphene enables a rapid heat dispersion in the in‐plane direction and provides an effective thermal insulation in the out‐of‐plane direction. The thermal conductivity calculations demonstrate an enhanced participation of phonons in heat conduction by the graphene layer, indicating a novel heat conduction mechanism in the Cu/single‐layer graphene system. These findings highlight the positive impact of graphene on the heat conduction of metals, and they will hold crucial implications for the design and application of graphene‐based thermal devices is believed. |
| first_indexed | 2024-04-24T09:37:32Z |
| format | Article |
| id | doaj.art-696f403aa04f466398dea252c25da0f2 |
| institution | Directory Open Access Journal |
| issn | 2196-7350 |
| language | English |
| last_indexed | 2024-04-24T09:37:32Z |
| publishDate | 2024-04-01 |
| publisher | Wiley-VCH |
| record_format | Article |
| series | Advanced Materials Interfaces |
| spelling | doaj.art-696f403aa04f466398dea252c25da0f22024-04-15T08:10:07ZengWiley-VCHAdvanced Materials Interfaces2196-73502024-04-011111n/an/a10.1002/admi.202300877Enhanced Heat Dissipation for Macroscopic Metals Achieved by a Single‐Layer GrapheneJiayuan Fang0Xujun Xu1Yang Zhang2Qiancheng Ren3Ning Wei4Pei Zhao5State Key Laboratory of Fluid Power and Mechatronic Systems Zhejiang University Hangzhou 310027 P. R. ChinaJiangsu Key Laboratory of Advanced Food Manufacturing Equipment and Technology Jiangnan University Wuxi 214122 P. R. ChinaState Key Laboratory of Fluid Power and Mechatronic Systems Zhejiang University Hangzhou 310027 P. R. ChinaState Key Laboratory of Fluid Power and Mechatronic Systems Zhejiang University Hangzhou 310027 P. R. ChinaJiangsu Key Laboratory of Advanced Food Manufacturing Equipment and Technology Jiangnan University Wuxi 214122 P. R. ChinaState Key Laboratory of Fluid Power and Mechatronic Systems Zhejiang University Hangzhou 310027 P. R. ChinaAbstract The increasing demand for high‐performance devices on heat dissipation makes it approach the bottleneck even for metals with high thermal conductivities. The coating of only one layer of graphene, the heat dissipation performances of Cu, Ag, and Al can be further enhanced, e.g., with a maximum temperature reduction by ≈9% for a Cu foil is demonstrated. Molecular dynamics (MD) analysis of spectral phonon transmission reveals that low‐frequency phonons play a significant role in the thermal transport within the Cu/single‐layer graphene (SLG) system, and the high‐frequency phonons exhibit substantial mismatch. It suggests that the thermal anisotropy of graphene enables a rapid heat dispersion in the in‐plane direction and provides an effective thermal insulation in the out‐of‐plane direction. The thermal conductivity calculations demonstrate an enhanced participation of phonons in heat conduction by the graphene layer, indicating a novel heat conduction mechanism in the Cu/single‐layer graphene system. These findings highlight the positive impact of graphene on the heat conduction of metals, and they will hold crucial implications for the design and application of graphene‐based thermal devices is believed.https://doi.org/10.1002/admi.202300877chemical vapor depositiongrapheneheat dissipationmetalmolecular dynamics |
| spellingShingle | Jiayuan Fang Xujun Xu Yang Zhang Qiancheng Ren Ning Wei Pei Zhao Enhanced Heat Dissipation for Macroscopic Metals Achieved by a Single‐Layer Graphene Advanced Materials Interfaces chemical vapor deposition graphene heat dissipation metal molecular dynamics |
| title | Enhanced Heat Dissipation for Macroscopic Metals Achieved by a Single‐Layer Graphene |
| title_full | Enhanced Heat Dissipation for Macroscopic Metals Achieved by a Single‐Layer Graphene |
| title_fullStr | Enhanced Heat Dissipation for Macroscopic Metals Achieved by a Single‐Layer Graphene |
| title_full_unstemmed | Enhanced Heat Dissipation for Macroscopic Metals Achieved by a Single‐Layer Graphene |
| title_short | Enhanced Heat Dissipation for Macroscopic Metals Achieved by a Single‐Layer Graphene |
| title_sort | enhanced heat dissipation for macroscopic metals achieved by a single layer graphene |
| topic | chemical vapor deposition graphene heat dissipation metal molecular dynamics |
| url | https://doi.org/10.1002/admi.202300877 |
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