Implication of low temperature and sonication on electrocrystallization mechanism of Cu thin films: a kinetics and structural correlation
The effect of an ultrasonic environment during electrodeposition of copper on graphite at various electrolyte temperatures of 25, 20, 15, 10 and 5 °C is reported in this investigation. Resulting Cu deposits formed by potentiostatic deposition were characterized by electrochemical methods, scanning e...
| Main Authors: | , |
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| Format: | Article |
| Language: | English |
| Published: |
Associação Brasileira de Metalurgia e Materiais (ABM); Associação Brasileira de Cerâmica (ABC); Associação Brasileira de Polímeros (ABPol)
2013-04-01
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| Series: | Materials Research |
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| Online Access: | http://www.scielo.br/scielo.php?script=sci_arttext&pid=S1516-14392013000200032 |
| _version_ | 1818268159996592128 |
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| author | Archana Mallik Bankim Chandra Ray |
| author_facet | Archana Mallik Bankim Chandra Ray |
| author_sort | Archana Mallik |
| collection | DOAJ |
| description | The effect of an ultrasonic environment during electrodeposition of copper on graphite at various electrolyte temperatures of 25, 20, 15, 10 and 5 °C is reported in this investigation. Resulting Cu deposits formed by potentiostatic deposition were characterized by electrochemical methods, scanning electron microscopy and atomic force microscopy. It was found that in presence of ultrasound the deposition kinetics was mainly dominated by the charge transfer. Copper nucleated according to 3D instantaneous mechanisms for all temperature ranges. The extent of nucleation was found to be increased at low temperatures. Diffusion coefficients and nuclei population density were calculated for each temperature range. Sonicated deposits with good surface coverage were found to consist of spherical copper agglomerates of nanosized particles. |
| first_indexed | 2024-12-12T20:34:04Z |
| format | Article |
| id | doaj.art-69fd007abda5424f9f7c4e449e9964e6 |
| institution | Directory Open Access Journal |
| issn | 1516-1439 |
| language | English |
| last_indexed | 2024-12-12T20:34:04Z |
| publishDate | 2013-04-01 |
| publisher | Associação Brasileira de Metalurgia e Materiais (ABM); Associação Brasileira de Cerâmica (ABC); Associação Brasileira de Polímeros (ABPol) |
| record_format | Article |
| series | Materials Research |
| spelling | doaj.art-69fd007abda5424f9f7c4e449e9964e62022-12-22T00:12:57ZengAssociação Brasileira de Metalurgia e Materiais (ABM); Associação Brasileira de Cerâmica (ABC); Associação Brasileira de Polímeros (ABPol)Materials Research1516-14392013-04-01162539545Implication of low temperature and sonication on electrocrystallization mechanism of Cu thin films: a kinetics and structural correlationArchana MallikBankim Chandra RayThe effect of an ultrasonic environment during electrodeposition of copper on graphite at various electrolyte temperatures of 25, 20, 15, 10 and 5 °C is reported in this investigation. Resulting Cu deposits formed by potentiostatic deposition were characterized by electrochemical methods, scanning electron microscopy and atomic force microscopy. It was found that in presence of ultrasound the deposition kinetics was mainly dominated by the charge transfer. Copper nucleated according to 3D instantaneous mechanisms for all temperature ranges. The extent of nucleation was found to be increased at low temperatures. Diffusion coefficients and nuclei population density were calculated for each temperature range. Sonicated deposits with good surface coverage were found to consist of spherical copper agglomerates of nanosized particles.http://www.scielo.br/scielo.php?script=sci_arttext&pid=S1516-14392013000200032electrocrystallizationthin filmcopperlow-temperaturesonicationcrystal nucleation kinetics |
| spellingShingle | Archana Mallik Bankim Chandra Ray Implication of low temperature and sonication on electrocrystallization mechanism of Cu thin films: a kinetics and structural correlation Materials Research electrocrystallization thin film copper low-temperature sonication crystal nucleation kinetics |
| title | Implication of low temperature and sonication on electrocrystallization mechanism of Cu thin films: a kinetics and structural correlation |
| title_full | Implication of low temperature and sonication on electrocrystallization mechanism of Cu thin films: a kinetics and structural correlation |
| title_fullStr | Implication of low temperature and sonication on electrocrystallization mechanism of Cu thin films: a kinetics and structural correlation |
| title_full_unstemmed | Implication of low temperature and sonication on electrocrystallization mechanism of Cu thin films: a kinetics and structural correlation |
| title_short | Implication of low temperature and sonication on electrocrystallization mechanism of Cu thin films: a kinetics and structural correlation |
| title_sort | implication of low temperature and sonication on electrocrystallization mechanism of cu thin films a kinetics and structural correlation |
| topic | electrocrystallization thin film copper low-temperature sonication crystal nucleation kinetics |
| url | http://www.scielo.br/scielo.php?script=sci_arttext&pid=S1516-14392013000200032 |
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