Recent advances in Sn-based lead-free solder interconnects for microelectronics packaging: Materials and technologies

Recent advances in Sn-based lead-free solder interconnects for microelectronics packaging: Materials and technologies

The electronic industry faces a number of issues as a result of the rapid miniaturization of electronic products and the expansion of application areas, with the reliability of electronic packaging materials playing a significant role. Moreover, the continuously harsh service conditions of electroni...

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Bibliographic Details
Main Authors: T.T. Dele-Afolabi, M.N.M. Ansari, M.A. Azmah Hanim, A.A. Oyekanmi, O.J. Ojo-Kupoluyi, A. Atiqah
Format: Article
Language:English
Published: Elsevier 2023-07-01
Series:Journal of Materials Research and Technology
Subjects:
Sn-based solder
Intermetallic compounds
Interlayer components
ENImAg surface finish
Rotary magnetic field
Energy
Online Access:http://www.sciencedirect.com/science/article/pii/S2238785423014412

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