Composite Single Lap Shear Joint Integrity Monitoring via Embedded Electromechanical Impedance Sensors
Composite bonded structure is a prevalent portion of today’s aircraft structure. Adequate bond integrity is a critical aspect of fabrication and service, especially since many of today’s structural bonds are critical for flight safety. Over the last decade, non-destructive bond evaluation techniques...
| Main Authors: | , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2023-02-01
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| Series: | Journal of Composites Science |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2504-477X/7/2/53 |
| _version_ | 1797620129516748800 |
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| author | Steven P. Caldwell Donald W. Radford |
| author_facet | Steven P. Caldwell Donald W. Radford |
| author_sort | Steven P. Caldwell |
| collection | DOAJ |
| description | Composite bonded structure is a prevalent portion of today’s aircraft structure. Adequate bond integrity is a critical aspect of fabrication and service, especially since many of today’s structural bonds are critical for flight safety. Over the last decade, non-destructive bond evaluation techniques have improved but still cannot detect a structurally weak bond that exhibits full adherend/adhesive contact. The result is that expensive and time-consuming structural proof testing continues to be required to verify bond integrity. The objective of this work is to investigate the feasibility of bondline integrity monitoring using piezoelectric sensors, embedded at different locations within the composite joint, and to assess the benefits of monitoring the thickness mode in addition to the radial mode. Experiments and analyses are performed on single lap shear composite joints, with and without embedded sensors, subjected to incrementally increasing tensile loads. The results indicate that the embedded piezoelectric sensors measure a change in the resonance in both the radial and thickness mode during incremental loading and that the thickness resonance shows enhanced sensitivity to impending failure. Thus, it is demonstrated that monitoring both modes of the piezoelectric sensor provides addition details for prognostic performance evaluation. |
| first_indexed | 2024-03-11T08:37:06Z |
| format | Article |
| id | doaj.art-6a8f4aa9ccf8419398efd52966650952 |
| institution | Directory Open Access Journal |
| issn | 2504-477X |
| language | English |
| last_indexed | 2024-03-11T08:37:06Z |
| publishDate | 2023-02-01 |
| publisher | MDPI AG |
| record_format | Article |
| series | Journal of Composites Science |
| spelling | doaj.art-6a8f4aa9ccf8419398efd529666509522023-11-16T21:23:29ZengMDPI AGJournal of Composites Science2504-477X2023-02-01725310.3390/jcs7020053Composite Single Lap Shear Joint Integrity Monitoring via Embedded Electromechanical Impedance SensorsSteven P. Caldwell0Donald W. Radford1Composite Materials, Manufacture and Structures Laboratory, Colorado State University, Fort Collins, CO 80523, USAComposite Materials, Manufacture and Structures Laboratory, Colorado State University, Fort Collins, CO 80523, USAComposite bonded structure is a prevalent portion of today’s aircraft structure. Adequate bond integrity is a critical aspect of fabrication and service, especially since many of today’s structural bonds are critical for flight safety. Over the last decade, non-destructive bond evaluation techniques have improved but still cannot detect a structurally weak bond that exhibits full adherend/adhesive contact. The result is that expensive and time-consuming structural proof testing continues to be required to verify bond integrity. The objective of this work is to investigate the feasibility of bondline integrity monitoring using piezoelectric sensors, embedded at different locations within the composite joint, and to assess the benefits of monitoring the thickness mode in addition to the radial mode. Experiments and analyses are performed on single lap shear composite joints, with and without embedded sensors, subjected to incrementally increasing tensile loads. The results indicate that the embedded piezoelectric sensors measure a change in the resonance in both the radial and thickness mode during incremental loading and that the thickness resonance shows enhanced sensitivity to impending failure. Thus, it is demonstrated that monitoring both modes of the piezoelectric sensor provides addition details for prognostic performance evaluation.https://www.mdpi.com/2504-477X/7/2/53structural health monitoringsingle lap shear jointpiezoelectric sensorcomposite bondelectromechanical impedancefinite element modeling |
| spellingShingle | Steven P. Caldwell Donald W. Radford Composite Single Lap Shear Joint Integrity Monitoring via Embedded Electromechanical Impedance Sensors Journal of Composites Science structural health monitoring single lap shear joint piezoelectric sensor composite bond electromechanical impedance finite element modeling |
| title | Composite Single Lap Shear Joint Integrity Monitoring via Embedded Electromechanical Impedance Sensors |
| title_full | Composite Single Lap Shear Joint Integrity Monitoring via Embedded Electromechanical Impedance Sensors |
| title_fullStr | Composite Single Lap Shear Joint Integrity Monitoring via Embedded Electromechanical Impedance Sensors |
| title_full_unstemmed | Composite Single Lap Shear Joint Integrity Monitoring via Embedded Electromechanical Impedance Sensors |
| title_short | Composite Single Lap Shear Joint Integrity Monitoring via Embedded Electromechanical Impedance Sensors |
| title_sort | composite single lap shear joint integrity monitoring via embedded electromechanical impedance sensors |
| topic | structural health monitoring single lap shear joint piezoelectric sensor composite bond electromechanical impedance finite element modeling |
| url | https://www.mdpi.com/2504-477X/7/2/53 |
| work_keys_str_mv | AT stevenpcaldwell compositesinglelapshearjointintegritymonitoringviaembeddedelectromechanicalimpedancesensors AT donaldwradford compositesinglelapshearjointintegritymonitoringviaembeddedelectromechanicalimpedancesensors |