Design and Analysis of the IGBT Heat Dissipation Structure Based on Computational Continuum Mechanics

Design and Analysis of the IGBT Heat Dissipation Structure Based on Computational Continuum Mechanics

With the trend of high integration and high power of insulated gate bipolar transistor (IGBT) components, strict requirements have been placed on the heat dissipation capabilities of the IGBT devices. On the basis of traditional rectangular fins, this paper developed two new types of heat-dissipatin...

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Bibliographic Details
Main Authors: Xin Lin, Huawei Wu, Zhen Liu, Baosheng Ying, Congjin Ye, Yuanjin Zhang, Zhixiong Li
Format: Article
Language:English
Published: MDPI AG 2020-07-01
Series:Entropy
Subjects:
IGBT
heat dissipation
thermal simulation
numerical simulation
Online Access:https://www.mdpi.com/1099-4300/22/8/816

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