Effect of hold time on creep-fatigue crack propagation in lead-free solder
Crack propagation tests of lead-free solder were conducted using center-notched plates under load- and displacement-controlled conditions of cyclic tension-compression. Four waveforms were adopted for tests: pp waveform having fast loading and unloading, cc-h waveform having a hold time under tensio...
| Main Authors: | , , , , |
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| Format: | Article |
| Language: | Japanese |
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The Japan Society of Mechanical Engineers
2015-09-01
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| Series: | Nihon Kikai Gakkai ronbunshu |
| Subjects: | |
| Online Access: | https://www.jstage.jst.go.jp/article/transjsme/81/830/81_15-00213/_pdf/-char/en |
| _version_ | 1798018056793882624 |
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| author | Keisuke TANAKA Ryosuke MIZUNO Takashi FUJII Ryota SAKAI Kazunari FUJIYAMA |
| author_facet | Keisuke TANAKA Ryosuke MIZUNO Takashi FUJII Ryota SAKAI Kazunari FUJIYAMA |
| author_sort | Keisuke TANAKA |
| collection | DOAJ |
| description | Crack propagation tests of lead-free solder were conducted using center-notched plates under load- and displacement-controlled conditions of cyclic tension-compression. Four waveforms were adopted for tests: pp waveform having fast loading and unloading, cc-h waveform having a hold time under tension and compression, cp-h waveform having a hold time under tension, and pc-h waveform having a hold time under compression. The crack propagation rate was correlated to fatigue and creep components of the J-integral range determined from load-displacement curves. For pp waveforms, the crack propagation rate was expressed as a power function of fatigue J integral range and the relation was identical for load-controlled and displacement-controlled conditions. The creep component due to the hold time greatly accelerated the crack propagation rate when compared at the same values of the fatigue J integral, especially under load-controlled conditions of cc-h and cp-h waveforms. Not much acceleration of crack propagation was observed for displacement-controlled conditions. The creep crack propagation rate was expressed as a power function of the creep J integral range for each case of cp-h and cc-h waveforms. The crack propagation rate for cp-h waveforms is higher than that for cc-h waveforms. As a simple estimate, the apparent J-integral range was evaluated from the area between the loading curve and the straight line connecting maximum and minimum loads in load-displacement relations. The relation between crack propagation rate and apparent J-integral range for symmetrical loading waveforms such as cc-h was only slightly higher than that obtained for pp waveforms, and the relation for unsymmetrical loading waveforms with tensile hold such as cp-h was much higher. |
| first_indexed | 2024-04-11T16:17:45Z |
| format | Article |
| id | doaj.art-6bcecf80b4aa413b9957ccaaca2c8b70 |
| institution | Directory Open Access Journal |
| issn | 2187-9761 |
| language | Japanese |
| last_indexed | 2024-04-11T16:17:45Z |
| publishDate | 2015-09-01 |
| publisher | The Japan Society of Mechanical Engineers |
| record_format | Article |
| series | Nihon Kikai Gakkai ronbunshu |
| spelling | doaj.art-6bcecf80b4aa413b9957ccaaca2c8b702022-12-22T04:14:27ZjpnThe Japan Society of Mechanical EngineersNihon Kikai Gakkai ronbunshu2187-97612015-09-018183015-0021315-0021310.1299/transjsme.15-00213transjsmeEffect of hold time on creep-fatigue crack propagation in lead-free solderKeisuke TANAKA0Ryosuke MIZUNO1Takashi FUJII2Ryota SAKAI3Kazunari FUJIYAMA4Department of Mechanical Engineering, Meijo UniversityGraduate School, Department of Mechanical Engineering, Meijo UniversityGraduate School, Department of Mechanical Engineering, Meijo UniversityGraduate School, Department of Mechanical Engineering, Meijo UniversityDepartment of Mechanical Engineering, Meijo UniversityCrack propagation tests of lead-free solder were conducted using center-notched plates under load- and displacement-controlled conditions of cyclic tension-compression. Four waveforms were adopted for tests: pp waveform having fast loading and unloading, cc-h waveform having a hold time under tension and compression, cp-h waveform having a hold time under tension, and pc-h waveform having a hold time under compression. The crack propagation rate was correlated to fatigue and creep components of the J-integral range determined from load-displacement curves. For pp waveforms, the crack propagation rate was expressed as a power function of fatigue J integral range and the relation was identical for load-controlled and displacement-controlled conditions. The creep component due to the hold time greatly accelerated the crack propagation rate when compared at the same values of the fatigue J integral, especially under load-controlled conditions of cc-h and cp-h waveforms. Not much acceleration of crack propagation was observed for displacement-controlled conditions. The creep crack propagation rate was expressed as a power function of the creep J integral range for each case of cp-h and cc-h waveforms. The crack propagation rate for cp-h waveforms is higher than that for cc-h waveforms. As a simple estimate, the apparent J-integral range was evaluated from the area between the loading curve and the straight line connecting maximum and minimum loads in load-displacement relations. The relation between crack propagation rate and apparent J-integral range for symmetrical loading waveforms such as cc-h was only slightly higher than that obtained for pp waveforms, and the relation for unsymmetrical loading waveforms with tensile hold such as cp-h was much higher.https://www.jstage.jst.go.jp/article/transjsme/81/830/81_15-00213/_pdf/-char/encrack propagationlead-free solderj integralj-range partitioninghold time effectcreep-fatigue interaction |
| spellingShingle | Keisuke TANAKA Ryosuke MIZUNO Takashi FUJII Ryota SAKAI Kazunari FUJIYAMA Effect of hold time on creep-fatigue crack propagation in lead-free solder Nihon Kikai Gakkai ronbunshu crack propagation lead-free solder j integral j-range partitioning hold time effect creep-fatigue interaction |
| title | Effect of hold time on creep-fatigue crack propagation in lead-free solder |
| title_full | Effect of hold time on creep-fatigue crack propagation in lead-free solder |
| title_fullStr | Effect of hold time on creep-fatigue crack propagation in lead-free solder |
| title_full_unstemmed | Effect of hold time on creep-fatigue crack propagation in lead-free solder |
| title_short | Effect of hold time on creep-fatigue crack propagation in lead-free solder |
| title_sort | effect of hold time on creep fatigue crack propagation in lead free solder |
| topic | crack propagation lead-free solder j integral j-range partitioning hold time effect creep-fatigue interaction |
| url | https://www.jstage.jst.go.jp/article/transjsme/81/830/81_15-00213/_pdf/-char/en |
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