Fabrication and evaluation of high-performance 3D interpenetrated network structures SiC/Al composites with high-purity plate-like α-SiC framework

Fabrication and evaluation of high-performance 3D interpenetrated network structures SiC/Al composites with high-purity plate-like α-SiC framework

To reinforce compatibility with the thermophysical and mechanical properties of SiC/Al composites for electronic packaging to improve the stability and reduce fatigue failure of electronic integrated devices, a novel 3D SiC reinforced framework with interpenetrated plate-like α-SiC grains was synthe...

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Bibliographic Details
Main Authors: Jiawei Xie, Jinhui Zou, Liangcheng Tong, Syieluing Wong, Xin Guo, Hang Qin, Pengzhao Gao, Wenming Guo, Hanning Xiao
Format: Article
Language:English
Published: Elsevier 2024-03-01
Series:Journal of Materiomics
Subjects:
α-SiC seed
Phase transformation
Thermophysical properties
SiC3D/Al composites
Electronic packaging
Online Access:http://www.sciencedirect.com/science/article/pii/S2352847823001466

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