Numerical Analysis of the Welding Behaviors in Micro-Copper Bumps
In this study, three-dimensional simulations of the ultrasonic vibration bonding process of micro-copper blocks were conducted using the finite element method. We analyzed the effects of ultrasonic vibration frequency on the stress field, strain field, and temperature field at the copper bump joint...
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MDPI AG
2021-03-01
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| Series: | Metals |
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| Online Access: | https://www.mdpi.com/2075-4701/11/3/460 |
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| author | Yeong-Maw Hwang Cheng-Tang Pan Bo-Syun Chen Sheng-Rui Jian |
| author_facet | Yeong-Maw Hwang Cheng-Tang Pan Bo-Syun Chen Sheng-Rui Jian |
| author_sort | Yeong-Maw Hwang |
| collection | DOAJ |
| description | In this study, three-dimensional simulations of the ultrasonic vibration bonding process of micro-copper blocks were conducted using the finite element method. We analyzed the effects of ultrasonic vibration frequency on the stress field, strain field, and temperature field at the copper bump joint surface. The results showed that the bonding process is successfully simulated at room temperature. The stress curve of the bonding process could be divided into three stages: stress rising stage, stress falling stage, and stress stabilization stage. Moreover, it was found that the end of the curve exhibited characteristics of a solid solution phase at higher frequencies. It is hypothesized that the high-density dislocations formed at this stage may result in conveyance channels that facilitate the atomic diffusion at the contact surface. The simulation results indicated that copper micro-bump bonding occurs at an ultrasonic frequency of 50 kHz or higher. |
| first_indexed | 2024-03-10T13:21:17Z |
| format | Article |
| id | doaj.art-6c79dd4ae6f24846a07cff52c7cac964 |
| institution | Directory Open Access Journal |
| issn | 2075-4701 |
| language | English |
| last_indexed | 2024-03-10T13:21:17Z |
| publishDate | 2021-03-01 |
| publisher | MDPI AG |
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| series | Metals |
| spelling | doaj.art-6c79dd4ae6f24846a07cff52c7cac9642023-11-21T10:02:02ZengMDPI AGMetals2075-47012021-03-0111346010.3390/met11030460Numerical Analysis of the Welding Behaviors in Micro-Copper BumpsYeong-Maw Hwang0Cheng-Tang Pan1Bo-Syun Chen2Sheng-Rui Jian3Department of Mechanical and Electro-Mechanical Engineering, National Sun Yat-sen University, Kaohsiung 80424, TaiwanDepartment of Mechanical and Electro-Mechanical Engineering, National Sun Yat-sen University, Kaohsiung 80424, TaiwanDepartment of Mechanical and Electro-Mechanical Engineering, National Sun Yat-sen University, Kaohsiung 80424, TaiwanDepartment of Materials Science and Engineering, I-Shou University, Kaohsiung 84001, TaiwanIn this study, three-dimensional simulations of the ultrasonic vibration bonding process of micro-copper blocks were conducted using the finite element method. We analyzed the effects of ultrasonic vibration frequency on the stress field, strain field, and temperature field at the copper bump joint surface. The results showed that the bonding process is successfully simulated at room temperature. The stress curve of the bonding process could be divided into three stages: stress rising stage, stress falling stage, and stress stabilization stage. Moreover, it was found that the end of the curve exhibited characteristics of a solid solution phase at higher frequencies. It is hypothesized that the high-density dislocations formed at this stage may result in conveyance channels that facilitate the atomic diffusion at the contact surface. The simulation results indicated that copper micro-bump bonding occurs at an ultrasonic frequency of 50 kHz or higher.https://www.mdpi.com/2075-4701/11/3/460finite element methodcopper micro-bump bondingthermal ultrasonic vibrationwelding |
| spellingShingle | Yeong-Maw Hwang Cheng-Tang Pan Bo-Syun Chen Sheng-Rui Jian Numerical Analysis of the Welding Behaviors in Micro-Copper Bumps Metals finite element method copper micro-bump bonding thermal ultrasonic vibration welding |
| title | Numerical Analysis of the Welding Behaviors in Micro-Copper Bumps |
| title_full | Numerical Analysis of the Welding Behaviors in Micro-Copper Bumps |
| title_fullStr | Numerical Analysis of the Welding Behaviors in Micro-Copper Bumps |
| title_full_unstemmed | Numerical Analysis of the Welding Behaviors in Micro-Copper Bumps |
| title_short | Numerical Analysis of the Welding Behaviors in Micro-Copper Bumps |
| title_sort | numerical analysis of the welding behaviors in micro copper bumps |
| topic | finite element method copper micro-bump bonding thermal ultrasonic vibration welding |
| url | https://www.mdpi.com/2075-4701/11/3/460 |
| work_keys_str_mv | AT yeongmawhwang numericalanalysisoftheweldingbehaviorsinmicrocopperbumps AT chengtangpan numericalanalysisoftheweldingbehaviorsinmicrocopperbumps AT bosyunchen numericalanalysisoftheweldingbehaviorsinmicrocopperbumps AT shengruijian numericalanalysisoftheweldingbehaviorsinmicrocopperbumps |