Microwave-Assisted Solvent Bonding for Polymethyl Methacrylate Microfluidic Device
This paper demonstrated a microwave-assisted solvent bonding method that uses organic solvent to seal the thermoplastic substrates with microwave assistance. This direct bonding is a simple and straightforward process that starts with solvent application followed by microwave irradiation without the...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2022-07-01
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| Series: | Micromachines |
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| Online Access: | https://www.mdpi.com/2072-666X/13/7/1131 |
| _version_ | 1797433325163380736 |
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| author | Chia-Wen Tsao Chang-Yen Chang Po-Yen Chien |
| author_facet | Chia-Wen Tsao Chang-Yen Chang Po-Yen Chien |
| author_sort | Chia-Wen Tsao |
| collection | DOAJ |
| description | This paper demonstrated a microwave-assisted solvent bonding method that uses organic solvent to seal the thermoplastic substrates with microwave assistance. This direct bonding is a simple and straightforward process that starts with solvent application followed by microwave irradiation without the need for expensive facilities or complex procedures. The organic solvent applied at the bonding interface is used in dissolving and dielectric heating of the thermoplastic surfaces to seal the thermoplastic substrates under microwave assistance. We evaluated acetone and ethanol to seal the polymethyl methacrylate (PMMA) microfluidic device. The bonding performance, such as bonding coverage, geometry stability, and bonding strength (tensile) were observed and compared with the oven-heating and non-heating control experiments under the same force applications. Results showed that the microwave-assisted solvent bonding method presents a high bonding yield (maximum > 99%) and bonding strength (maximum ~2.77 MPa) without microchannel distortion, which can be used for various microfluidic applications. |
| first_indexed | 2024-03-09T10:15:26Z |
| format | Article |
| id | doaj.art-6ca36d09ffcd4a8998fde4d3764e49bf |
| institution | Directory Open Access Journal |
| issn | 2072-666X |
| language | English |
| last_indexed | 2024-03-09T10:15:26Z |
| publishDate | 2022-07-01 |
| publisher | MDPI AG |
| record_format | Article |
| series | Micromachines |
| spelling | doaj.art-6ca36d09ffcd4a8998fde4d3764e49bf2023-12-01T22:27:48ZengMDPI AGMicromachines2072-666X2022-07-01137113110.3390/mi13071131Microwave-Assisted Solvent Bonding for Polymethyl Methacrylate Microfluidic DeviceChia-Wen Tsao0Chang-Yen Chang1Po-Yen Chien2Department of Mechanical Engineering, National Central University, Taoyuan City 320, TaiwanDepartment of Mechanical Engineering, National Central University, Taoyuan City 320, TaiwanDepartment of Mechanical Engineering, National Central University, Taoyuan City 320, TaiwanThis paper demonstrated a microwave-assisted solvent bonding method that uses organic solvent to seal the thermoplastic substrates with microwave assistance. This direct bonding is a simple and straightforward process that starts with solvent application followed by microwave irradiation without the need for expensive facilities or complex procedures. The organic solvent applied at the bonding interface is used in dissolving and dielectric heating of the thermoplastic surfaces to seal the thermoplastic substrates under microwave assistance. We evaluated acetone and ethanol to seal the polymethyl methacrylate (PMMA) microfluidic device. The bonding performance, such as bonding coverage, geometry stability, and bonding strength (tensile) were observed and compared with the oven-heating and non-heating control experiments under the same force applications. Results showed that the microwave-assisted solvent bonding method presents a high bonding yield (maximum > 99%) and bonding strength (maximum ~2.77 MPa) without microchannel distortion, which can be used for various microfluidic applications.https://www.mdpi.com/2072-666X/13/7/1131polymer microfluidicsthermoplastic bondingsolvent bondingmicrowave heating |
| spellingShingle | Chia-Wen Tsao Chang-Yen Chang Po-Yen Chien Microwave-Assisted Solvent Bonding for Polymethyl Methacrylate Microfluidic Device Micromachines polymer microfluidics thermoplastic bonding solvent bonding microwave heating |
| title | Microwave-Assisted Solvent Bonding for Polymethyl Methacrylate Microfluidic Device |
| title_full | Microwave-Assisted Solvent Bonding for Polymethyl Methacrylate Microfluidic Device |
| title_fullStr | Microwave-Assisted Solvent Bonding for Polymethyl Methacrylate Microfluidic Device |
| title_full_unstemmed | Microwave-Assisted Solvent Bonding for Polymethyl Methacrylate Microfluidic Device |
| title_short | Microwave-Assisted Solvent Bonding for Polymethyl Methacrylate Microfluidic Device |
| title_sort | microwave assisted solvent bonding for polymethyl methacrylate microfluidic device |
| topic | polymer microfluidics thermoplastic bonding solvent bonding microwave heating |
| url | https://www.mdpi.com/2072-666X/13/7/1131 |
| work_keys_str_mv | AT chiawentsao microwaveassistedsolventbondingforpolymethylmethacrylatemicrofluidicdevice AT changyenchang microwaveassistedsolventbondingforpolymethylmethacrylatemicrofluidicdevice AT poyenchien microwaveassistedsolventbondingforpolymethylmethacrylatemicrofluidicdevice |