PHYSICAL ASPECTS OF LOW TEMPERATURE SOLDERING WITH GA-SOLDERS

Analysis of activation of solution and diffusion processes under the interaction between melt and solid is used. Dependence of the original material concentration on temperature, time, melt and solid area of contact, viscosity and melt volume is derived.

Bibliographic Details
Main Authors: A. A. CHULARIS, M. M. MIKHAYLOVA, G. V. CHUMACHENKO
Format: Article
Language:Russian
Published: Don State Technical University 2010-04-01
Series:Advanced Engineering Research
Subjects:
Online Access:https://www.vestnik-donstu.ru/jour/article/view/961
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author A. A. CHULARIS
M. M. MIKHAYLOVA
G. V. CHUMACHENKO
author_facet A. A. CHULARIS
M. M. MIKHAYLOVA
G. V. CHUMACHENKO
author_sort A. A. CHULARIS
collection DOAJ
description Analysis of activation of solution and diffusion processes under the interaction between melt and solid is used. Dependence of the original material concentration on temperature, time, melt and solid area of contact, viscosity and melt volume is derived.
first_indexed 2024-04-10T03:22:13Z
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issn 2687-1653
language Russian
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spelling doaj.art-6d76ad426b764ce6af879818270157f42023-03-13T07:31:18ZrusDon State Technical UniversityAdvanced Engineering Research2687-16532010-04-01102183188949PHYSICAL ASPECTS OF LOW TEMPERATURE SOLDERING WITH GA-SOLDERSA. A. CHULARIS0M. M. MIKHAYLOVA1G. V. CHUMACHENKO2Донской государственный технический университетДонской государственный технический университетДонской государственный технический университетAnalysis of activation of solution and diffusion processes under the interaction between melt and solid is used. Dependence of the original material concentration on temperature, time, melt and solid area of contact, viscosity and melt volume is derived.https://www.vestnik-donstu.ru/jour/article/view/961пайкагаллиевые пасты-припоиалюминий.
spellingShingle A. A. CHULARIS
M. M. MIKHAYLOVA
G. V. CHUMACHENKO
PHYSICAL ASPECTS OF LOW TEMPERATURE SOLDERING WITH GA-SOLDERS
Advanced Engineering Research
пайка
галлиевые пасты-припои
алюминий.
title PHYSICAL ASPECTS OF LOW TEMPERATURE SOLDERING WITH GA-SOLDERS
title_full PHYSICAL ASPECTS OF LOW TEMPERATURE SOLDERING WITH GA-SOLDERS
title_fullStr PHYSICAL ASPECTS OF LOW TEMPERATURE SOLDERING WITH GA-SOLDERS
title_full_unstemmed PHYSICAL ASPECTS OF LOW TEMPERATURE SOLDERING WITH GA-SOLDERS
title_short PHYSICAL ASPECTS OF LOW TEMPERATURE SOLDERING WITH GA-SOLDERS
title_sort physical aspects of low temperature soldering with ga solders
topic пайка
галлиевые пасты-припои
алюминий.
url https://www.vestnik-donstu.ru/jour/article/view/961
work_keys_str_mv AT aachularis physicalaspectsoflowtemperaturesolderingwithgasolders
AT mmmikhaylova physicalaspectsoflowtemperaturesolderingwithgasolders
AT gvchumachenko physicalaspectsoflowtemperaturesolderingwithgasolders