PHYSICAL ASPECTS OF LOW TEMPERATURE SOLDERING WITH GA-SOLDERS

PHYSICAL ASPECTS OF LOW TEMPERATURE SOLDERING WITH GA-SOLDERS

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Analysis of activation of solution and diffusion processes under the interaction between melt and solid is used. Dependence of the original material concentration on temperature, time, melt and solid area of contact, viscosity and melt volume is derived.

Bibliographic Details
Main Authors:	A. A. CHULARIS, M. M. MIKHAYLOVA, G. V. CHUMACHENKO
Format:	Article
Language:	Russian
Published:	Don State Technical University 2010-04-01
Series:	Advanced Engineering Research
Subjects:	пайка галлиевые пасты-припои алюминий.
Online Access:	https://www.vestnik-donstu.ru/jour/article/view/961

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