A critique of the approach to controlling electrostatic risk in semiconductor production and identification of a potential risk from the use of equipotential bonding
Equipotential bonding, whereby objects are connected to a common electrical potential (usually ground) to prevent electrostatic discharges during material handling, has been shown to increase the risk of field-induced reticle damage. It is explained how the presence of an electric field can cause el...
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| Формат: | Стаття |
| Мова: | English |
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AIMS Press
2019-01-01
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| Серія: | AIMS Electronics and Electrical Engineering |
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| Онлайн доступ: | https://www.aimspress.com/article/10.3934/ElectrEng.2019.4.397/fulltext.html |