A critique of the approach to controlling electrostatic risk in semiconductor production and identification of a potential risk from the use of equipotential bonding
Equipotential bonding, whereby objects are connected to a common electrical potential (usually ground) to prevent electrostatic discharges during material handling, has been shown to increase the risk of field-induced reticle damage. It is explained how the presence of an electric field can cause el...
| 主要作者: | |
|---|---|
| 格式: | Article |
| 語言: | English |
| 出版: |
AIMS Press
2019-01-01
|
| 叢編: | AIMS Electronics and Electrical Engineering |
| 主題: | |
| 在線閱讀: | https://www.aimspress.com/article/10.3934/ElectrEng.2019.4.397/fulltext.html |