Influence of Deposition Temperature on the Structure and Current-Carrying Friction Performance of Cu Films by DC Magnetron Sputtering Technology
The structure and morphology of Cu films deposited by DC magnetron sputtering on silicon and stainless-steel substrates at different deposition temperatures of −140 °C, −95 °C, −55 °C, 25 °C (RT), 50 °C, and 200 °C were investigated by X-ray diffraction (XRD), scanning electron microscopy (SEM), and...
| Autori principali: | , , , , , |
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| Natura: | Articolo |
| Lingua: | English |
| Pubblicazione: |
MDPI AG
2022-12-01
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| Serie: | Lubricants |
| Soggetti: | |
| Accesso online: | https://www.mdpi.com/2075-4442/11/1/8 |