Preparation of Ultra-Smooth Cu Surface for High-Quality Graphene Synthesis
Abstract As grown graphene by chemical vapor deposition typically degrades greatly due to the presence of grain boundaries, which limit graphene’s excellent properties and integration into advanced applications. It has been demonstrated that there is a strong correlation between substrate morphology...
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Language: | English |
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SpringerOpen
2018-10-01
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Series: | Nanoscale Research Letters |
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Online Access: | http://link.springer.com/article/10.1186/s11671-018-2740-x |
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author | Longlong Zhan Yue Wang Huicong Chang Richard Stehle Jie Xu Libo Gao Wanli Zhang Yi Jia Fangzhu Qing Xuesong Li |
author_facet | Longlong Zhan Yue Wang Huicong Chang Richard Stehle Jie Xu Libo Gao Wanli Zhang Yi Jia Fangzhu Qing Xuesong Li |
author_sort | Longlong Zhan |
collection | DOAJ |
description | Abstract As grown graphene by chemical vapor deposition typically degrades greatly due to the presence of grain boundaries, which limit graphene’s excellent properties and integration into advanced applications. It has been demonstrated that there is a strong correlation between substrate morphology and graphene domain density. Here, we investigate how thermal annealing and electro-polishing affects the morphology of Cu foils. Ultra-smooth Cu surfaces can be achieved and maintained at elevated temperatures by electro-polishing after a pre-annealing treatment. This technique has shown to be more effective than just electro-polishing the Cu substrate without pre-annealing. This may be due to the remaining dislocations and point defects within the Cu bulk material moving to the surface when the Cu is heated. Likewise, a pre-annealing step may release them. Graphene grown on annealed electro-polished Cu substrates show a better quality in terms of lower domain density and higher layer uniformity than those grown on Cu substrates with only annealing or only electro-polishing treatment. |
first_indexed | 2024-03-12T07:11:12Z |
format | Article |
id | doaj.art-6e7693defbb642179070bd39ae076b80 |
institution | Directory Open Access Journal |
issn | 1931-7573 1556-276X |
language | English |
last_indexed | 2024-03-12T07:11:12Z |
publishDate | 2018-10-01 |
publisher | SpringerOpen |
record_format | Article |
series | Nanoscale Research Letters |
spelling | doaj.art-6e7693defbb642179070bd39ae076b802023-09-02T23:07:14ZengSpringerOpenNanoscale Research Letters1931-75731556-276X2018-10-011311610.1186/s11671-018-2740-xPreparation of Ultra-Smooth Cu Surface for High-Quality Graphene SynthesisLonglong Zhan0Yue Wang1Huicong Chang2Richard Stehle3Jie Xu4Libo Gao5Wanli Zhang6Yi Jia7Fangzhu Qing8Xuesong Li9State Key Laboratory of Electronic Thin Films and Integrated Devices & School of Electronic Science and Engineering, University of Electronic Science and Technology of ChinaState Key Laboratory of Electronic Thin Films and Integrated Devices & School of Electronic Science and Engineering, University of Electronic Science and Technology of ChinaQian Xuesen Laboratory of Space Technology, China Academy of Space TechnologyMechanical Engineering Department, Sichuan University-Pittsburgh Institute, Sichuan University Jiang’an CampusNational Laboratory of Solid State Microstructures, School of Physics, Collaborative Innovation Center of Advanced Microstructures, Nanjing UniversityNational Laboratory of Solid State Microstructures, School of Physics, Collaborative Innovation Center of Advanced Microstructures, Nanjing UniversityState Key Laboratory of Electronic Thin Films and Integrated Devices & School of Electronic Science and Engineering, University of Electronic Science and Technology of ChinaQian Xuesen Laboratory of Space Technology, China Academy of Space TechnologyState Key Laboratory of Electronic Thin Films and Integrated Devices & School of Electronic Science and Engineering, University of Electronic Science and Technology of ChinaState Key Laboratory of Electronic Thin Films and Integrated Devices & School of Electronic Science and Engineering, University of Electronic Science and Technology of ChinaAbstract As grown graphene by chemical vapor deposition typically degrades greatly due to the presence of grain boundaries, which limit graphene’s excellent properties and integration into advanced applications. It has been demonstrated that there is a strong correlation between substrate morphology and graphene domain density. Here, we investigate how thermal annealing and electro-polishing affects the morphology of Cu foils. Ultra-smooth Cu surfaces can be achieved and maintained at elevated temperatures by electro-polishing after a pre-annealing treatment. This technique has shown to be more effective than just electro-polishing the Cu substrate without pre-annealing. This may be due to the remaining dislocations and point defects within the Cu bulk material moving to the surface when the Cu is heated. Likewise, a pre-annealing step may release them. Graphene grown on annealed electro-polished Cu substrates show a better quality in terms of lower domain density and higher layer uniformity than those grown on Cu substrates with only annealing or only electro-polishing treatment.http://link.springer.com/article/10.1186/s11671-018-2740-xGrapheneCu surfaceAnnealingElectro-polishing |
spellingShingle | Longlong Zhan Yue Wang Huicong Chang Richard Stehle Jie Xu Libo Gao Wanli Zhang Yi Jia Fangzhu Qing Xuesong Li Preparation of Ultra-Smooth Cu Surface for High-Quality Graphene Synthesis Nanoscale Research Letters Graphene Cu surface Annealing Electro-polishing |
title | Preparation of Ultra-Smooth Cu Surface for High-Quality Graphene Synthesis |
title_full | Preparation of Ultra-Smooth Cu Surface for High-Quality Graphene Synthesis |
title_fullStr | Preparation of Ultra-Smooth Cu Surface for High-Quality Graphene Synthesis |
title_full_unstemmed | Preparation of Ultra-Smooth Cu Surface for High-Quality Graphene Synthesis |
title_short | Preparation of Ultra-Smooth Cu Surface for High-Quality Graphene Synthesis |
title_sort | preparation of ultra smooth cu surface for high quality graphene synthesis |
topic | Graphene Cu surface Annealing Electro-polishing |
url | http://link.springer.com/article/10.1186/s11671-018-2740-x |
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