A low-profile electromechanical packaging system for soft-to-flexible bioelectronic interfaces
Interfacing the human body with the next generation of electronics requires technological advancement in designing and producing bioelectronic circuits. These circuits must integrate electrical functionality while simultaneously addressing limitations in mechanical compliance and dynamics, biocompat...
| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
AIP Publishing LLC
2023-09-01
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| Series: | APL Bioengineering |
| Online Access: | http://dx.doi.org/10.1063/5.0152509 |