Silicone-Based Thermally Conductive Gel Fabrication via Hybridization of Low-Melting-Point Alloy–Hexagonal Boron Nitride–Graphene Oxide
Thermal contact resistance between the microprocessor chip and the heat sink has long been a focus of thermal management research in electronics. Thermally conductive gel, as a thermal interface material for efficient heat transfer between high-power components and heat sinks, can effectively reduce...
Main Authors: | Peijia Chen, Xin Ge, Zhicong Zhang, Shuang Yin, Weijie Liang, Jianfang Ge |
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Format: | Article |
Language: | English |
Published: |
MDPI AG
2023-01-01
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Series: | Nanomaterials |
Subjects: | |
Online Access: | https://www.mdpi.com/2079-4991/13/3/490 |
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