Morphology Evaluation of Microelectronic Packaging Substrates Using Shadow Moiré Technique
The surface quality and long-term reliability of packaging substrates in microelectronic packaging processes have become subjects of increasing concern as circuit board component density increases while the pitches of these components decrease. As a result, packaging substrate morphology inspection...
| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
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IEEE
2018-01-01
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| Series: | IEEE Access |
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| Online Access: | https://ieeexplore.ieee.org/document/8370237/ |
| _version_ | 1818411672852758528 |
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| author | Fulong Zhu Xinxin Lin Wei Zhang Jiajie Fan Sheng Liu |
| author_facet | Fulong Zhu Xinxin Lin Wei Zhang Jiajie Fan Sheng Liu |
| author_sort | Fulong Zhu |
| collection | DOAJ |
| description | The surface quality and long-term reliability of packaging substrates in microelectronic packaging processes have become subjects of increasing concern as circuit board component density increases while the pitches of these components decrease. As a result, packaging substrate morphology inspection is becoming more crucial than ever before. This paper presents a noncontact measurement technology based on a shadow moiré technique to evaluate the surface quality and morphology of microelectronic packaging substrates. Fringe pattern images of packaging substrates are acquired through the noncontact measurement technology, and the resulting images are then analyzed using the phase-shifting technique to determine the morphology and surface quality (specifically, the flatness) of the microelectronic packaging substrates. A full-field morphology measurement system with adjustable sensitivity and measurement range was developed. The measurement system was tested using three typical types of microelectronic packaging substrate, a coin and a step made from two standard gauge blocks. The measurement system proved to be both feasible and effective by the test results. |
| first_indexed | 2024-12-14T10:35:09Z |
| format | Article |
| id | doaj.art-6f83775604f5405796e2babe683e3a35 |
| institution | Directory Open Access Journal |
| issn | 2169-3536 |
| language | English |
| last_indexed | 2024-12-14T10:35:09Z |
| publishDate | 2018-01-01 |
| publisher | IEEE |
| record_format | Article |
| series | IEEE Access |
| spelling | doaj.art-6f83775604f5405796e2babe683e3a352022-12-21T23:05:59ZengIEEEIEEE Access2169-35362018-01-016330993311010.1109/ACCESS.2018.28421998370237Morphology Evaluation of Microelectronic Packaging Substrates Using Shadow Moiré TechniqueFulong Zhu0https://orcid.org/0000-0002-0756-9051Xinxin Lin1Wei Zhang2Jiajie Fan3Sheng Liu4School of Mechanical Science and Engineering, Institute of Microsystems, Huazhong University of Science and Technology, Wuhan, ChinaSchool of Mechanical Science and Engineering, Institute of Microsystems, Huazhong University of Science and Technology, Wuhan, ChinaDepartment of Mechanical Engineering, Hubei University of Automotive Technology, Shiyan, ChinaSchool of Mechanical and Electrical Engineering, Hohai University, Changzhou, ChinaSchool of Mechanical Science and Engineering, Institute of Microsystems, Huazhong University of Science and Technology, Wuhan, ChinaThe surface quality and long-term reliability of packaging substrates in microelectronic packaging processes have become subjects of increasing concern as circuit board component density increases while the pitches of these components decrease. As a result, packaging substrate morphology inspection is becoming more crucial than ever before. This paper presents a noncontact measurement technology based on a shadow moiré technique to evaluate the surface quality and morphology of microelectronic packaging substrates. Fringe pattern images of packaging substrates are acquired through the noncontact measurement technology, and the resulting images are then analyzed using the phase-shifting technique to determine the morphology and surface quality (specifically, the flatness) of the microelectronic packaging substrates. A full-field morphology measurement system with adjustable sensitivity and measurement range was developed. The measurement system was tested using three typical types of microelectronic packaging substrate, a coin and a step made from two standard gauge blocks. The measurement system proved to be both feasible and effective by the test results.https://ieeexplore.ieee.org/document/8370237/Morphologymicroelectronic packaging substratephase-shiftingshadow moiré |
| spellingShingle | Fulong Zhu Xinxin Lin Wei Zhang Jiajie Fan Sheng Liu Morphology Evaluation of Microelectronic Packaging Substrates Using Shadow Moiré Technique IEEE Access Morphology microelectronic packaging substrate phase-shifting shadow moiré |
| title | Morphology Evaluation of Microelectronic Packaging Substrates Using Shadow Moiré Technique |
| title_full | Morphology Evaluation of Microelectronic Packaging Substrates Using Shadow Moiré Technique |
| title_fullStr | Morphology Evaluation of Microelectronic Packaging Substrates Using Shadow Moiré Technique |
| title_full_unstemmed | Morphology Evaluation of Microelectronic Packaging Substrates Using Shadow Moiré Technique |
| title_short | Morphology Evaluation of Microelectronic Packaging Substrates Using Shadow Moiré Technique |
| title_sort | morphology evaluation of microelectronic packaging substrates using shadow moir x00e9 technique |
| topic | Morphology microelectronic packaging substrate phase-shifting shadow moiré |
| url | https://ieeexplore.ieee.org/document/8370237/ |
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