Electronic Topological Transition as a Route to Improve Thermoelectric Performance in Bi0.5Sb1.5Te3

Abstract The electronic structure near the Fermi surface determines the electrical properties of the materials, which can be effectively tuned by external pressure. Bi0.5Sb1.5Te3 is a p‐type thermoelectric material which holds the record high figure of merit at room temperature. Here it is examined...

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Main Authors: Feng‐Xian Bai, Hao Yu, Ya‐Kang Peng, Shan Li, Li Yin, Ge Huang, Liu‐Cheng Chen, Alexander F. Goncharov, Jie‐He Sui, Feng Cao, Jun Mao, Qian Zhang, Xiao‐Jia Chen
Format: Article
Language:English
Published: Wiley 2022-05-01
Series:Advanced Science
Subjects:
Online Access:https://doi.org/10.1002/advs.202105709
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author Feng‐Xian Bai
Hao Yu
Ya‐Kang Peng
Shan Li
Li Yin
Ge Huang
Liu‐Cheng Chen
Alexander F. Goncharov
Jie‐He Sui
Feng Cao
Jun Mao
Qian Zhang
Xiao‐Jia Chen
author_facet Feng‐Xian Bai
Hao Yu
Ya‐Kang Peng
Shan Li
Li Yin
Ge Huang
Liu‐Cheng Chen
Alexander F. Goncharov
Jie‐He Sui
Feng Cao
Jun Mao
Qian Zhang
Xiao‐Jia Chen
author_sort Feng‐Xian Bai
collection DOAJ
description Abstract The electronic structure near the Fermi surface determines the electrical properties of the materials, which can be effectively tuned by external pressure. Bi0.5Sb1.5Te3 is a p‐type thermoelectric material which holds the record high figure of merit at room temperature. Here it is examined whether the figure of merit of this model system can be further enhanced through some external parameter. With the application of pressure, it is surprisingly found that the power factor of this material exhibits λ behavior with a high value of 4.8 mW m−1 K−2 at pressure of 1.8 GPa. Such an enhancement is found to be driven by pressure‐induced electronic topological transition, which is revealed by multiple techniques. Together with a low thermal conductivity of about 0.89 W m−1 K−1 at the same pressure, a figure of merit of 1.6 is achieved at room temperature. The results and findings highlight the electronic topological transition as a new route for improving the thermoelectric properties.
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spelling doaj.art-6f95847e59444568a1a8e6f42690575d2022-12-22T00:40:23ZengWileyAdvanced Science2198-38442022-05-01914n/an/a10.1002/advs.202105709Electronic Topological Transition as a Route to Improve Thermoelectric Performance in Bi0.5Sb1.5Te3Feng‐Xian Bai0Hao Yu1Ya‐Kang Peng2Shan Li3Li Yin4Ge Huang5Liu‐Cheng Chen6Alexander F. Goncharov7Jie‐He Sui8Feng Cao9Jun Mao10Qian Zhang11Xiao‐Jia Chen12School of Materials Science and Engineering and Institute of Materials Genome & Big Data Harbin Institute of Technology Shenzhen 518055 ChinaCenter for High Pressure Science and Technology Advanced Research Shanghai 201203 ChinaCenter for High Pressure Science and Technology Advanced Research Shanghai 201203 ChinaSchool of Materials Science and Engineering and Institute of Materials Genome & Big Data Harbin Institute of Technology Shenzhen 518055 ChinaSchool of Materials Science and Engineering and Institute of Materials Genome & Big Data Harbin Institute of Technology Shenzhen 518055 ChinaCenter for High Pressure Science and Technology Advanced Research Shanghai 201203 ChinaCenter for High Pressure Science and Technology Advanced Research Shanghai 201203 ChinaEarth and Planets Laboratory Carnegie Institution for Science Washington D.C. 20015 USAState Key Laboratory of Advanced Welding and Joining Harbin Institute of Technology Harbin 150001 ChinaSchool of Science Harbin Institute of Technology Shenzhen 518055 ChinaSchool of Materials Science and Engineering and Institute of Materials Genome & Big Data Harbin Institute of Technology Shenzhen 518055 ChinaSchool of Materials Science and Engineering and Institute of Materials Genome & Big Data Harbin Institute of Technology Shenzhen 518055 ChinaCenter for High Pressure Science and Technology Advanced Research Shanghai 201203 ChinaAbstract The electronic structure near the Fermi surface determines the electrical properties of the materials, which can be effectively tuned by external pressure. Bi0.5Sb1.5Te3 is a p‐type thermoelectric material which holds the record high figure of merit at room temperature. Here it is examined whether the figure of merit of this model system can be further enhanced through some external parameter. With the application of pressure, it is surprisingly found that the power factor of this material exhibits λ behavior with a high value of 4.8 mW m−1 K−2 at pressure of 1.8 GPa. Such an enhancement is found to be driven by pressure‐induced electronic topological transition, which is revealed by multiple techniques. Together with a low thermal conductivity of about 0.89 W m−1 K−1 at the same pressure, a figure of merit of 1.6 is achieved at room temperature. The results and findings highlight the electronic topological transition as a new route for improving the thermoelectric properties.https://doi.org/10.1002/advs.202105709Bi0.5Sb1.5Te3electronic topological transitionpressurethermoelectric materials
spellingShingle Feng‐Xian Bai
Hao Yu
Ya‐Kang Peng
Shan Li
Li Yin
Ge Huang
Liu‐Cheng Chen
Alexander F. Goncharov
Jie‐He Sui
Feng Cao
Jun Mao
Qian Zhang
Xiao‐Jia Chen
Electronic Topological Transition as a Route to Improve Thermoelectric Performance in Bi0.5Sb1.5Te3
Advanced Science
Bi0.5Sb1.5Te3
electronic topological transition
pressure
thermoelectric materials
title Electronic Topological Transition as a Route to Improve Thermoelectric Performance in Bi0.5Sb1.5Te3
title_full Electronic Topological Transition as a Route to Improve Thermoelectric Performance in Bi0.5Sb1.5Te3
title_fullStr Electronic Topological Transition as a Route to Improve Thermoelectric Performance in Bi0.5Sb1.5Te3
title_full_unstemmed Electronic Topological Transition as a Route to Improve Thermoelectric Performance in Bi0.5Sb1.5Te3
title_short Electronic Topological Transition as a Route to Improve Thermoelectric Performance in Bi0.5Sb1.5Te3
title_sort electronic topological transition as a route to improve thermoelectric performance in bi0 5sb1 5te3
topic Bi0.5Sb1.5Te3
electronic topological transition
pressure
thermoelectric materials
url https://doi.org/10.1002/advs.202105709
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