Tuning formation process of void defects in microcolumn arrays via pulse reverse electrodeposition
The pulse reverse current electrodeposition process consists of two stages: the forward deposition and reverse dissolution. This study aims to understand the characteristics of forward deposition and reverse dissolution and to reveal their influences on the formation of void defects in electrodeposi...
| Main Authors: | , , , , , |
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| Format: | Article |
| Language: | English |
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Elsevier
2023-05-01
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| Series: | Journal of Materials Research and Technology |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2238785423006646 |
| _version_ | 1797798802895142912 |
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| author | Yanzhuo Dong Bingyan Jiang Jun Qiang Zhigao Ma Dietmar Drummer Lu Zhang |
| author_facet | Yanzhuo Dong Bingyan Jiang Jun Qiang Zhigao Ma Dietmar Drummer Lu Zhang |
| author_sort | Yanzhuo Dong |
| collection | DOAJ |
| description | The pulse reverse current electrodeposition process consists of two stages: the forward deposition and reverse dissolution. This study aims to understand the characteristics of forward deposition and reverse dissolution and to reveal their influences on the formation of void defects in electrodeposited microcolumn arrays. Both the simulation and experimental results show that pulse reverse current contributes to the void-free deposition of microcolumn arrays. During the deposition under forward pulse stage, the thickness of deposited layer in micro cavities via pulse reverse current is more uniform compared with direct current. Meanwhile, the dissolution behavior under reverse pulse stage is greatly determined by the reverse pulse current density. A low reverse pulse current density (1 A/dm2) leads to a slow dissolution at the mouth of micro cavities. In contrast, a high reverse pulse current density (4 A/dm2) contributes to a high electrolyte potential, as well as a rapid dissolution at the mouth of micro cavities, which helps to eliminate void defects. The experimental results exhibit that void-free microcolumn arrays with a high aspect ratio of 5:1 are obtained via pulse reverse current. This study provides a clear understanding on the formation process of void defects in microcolumn arrays via pulse reverse electrodeposition. |
| first_indexed | 2024-03-13T04:09:22Z |
| format | Article |
| id | doaj.art-70ba4b99132248ecb20dd91e6b740d5b |
| institution | Directory Open Access Journal |
| issn | 2238-7854 |
| language | English |
| last_indexed | 2024-03-13T04:09:22Z |
| publishDate | 2023-05-01 |
| publisher | Elsevier |
| record_format | Article |
| series | Journal of Materials Research and Technology |
| spelling | doaj.art-70ba4b99132248ecb20dd91e6b740d5b2023-06-21T06:56:16ZengElsevierJournal of Materials Research and Technology2238-78542023-05-012430553066Tuning formation process of void defects in microcolumn arrays via pulse reverse electrodepositionYanzhuo Dong0Bingyan Jiang1Jun Qiang2Zhigao Ma3Dietmar Drummer4Lu Zhang5State Key Laboratory of Precision Manufacturing for Extreme Service Performance, Changsha 410083, China; School of Mechanical and Electrical Engineering, Central South University, Changsha 410083, ChinaState Key Laboratory of Precision Manufacturing for Extreme Service Performance, Changsha 410083, China; School of Mechanical and Electrical Engineering, Central South University, Changsha 410083, China; Corresponding author.State Key Laboratory of Precision Manufacturing for Extreme Service Performance, Changsha 410083, China; School of Mechanical and Electrical Engineering, Central South University, Changsha 410083, ChinaState Key Laboratory of Precision Manufacturing for Extreme Service Performance, Changsha 410083, China; School of Mechanical and Electrical Engineering, Central South University, Changsha 410083, ChinaInstitute of Polymer Technology, Friedrich-Alexander-University Erlangen-Nuremberg, Am Weichselgarten 9, Erlangen D-91058, GermanyState Key Laboratory of Precision Manufacturing for Extreme Service Performance, Changsha 410083, China; School of Mechanical and Electrical Engineering, Central South University, Changsha 410083, China; Corresponding author.The pulse reverse current electrodeposition process consists of two stages: the forward deposition and reverse dissolution. This study aims to understand the characteristics of forward deposition and reverse dissolution and to reveal their influences on the formation of void defects in electrodeposited microcolumn arrays. Both the simulation and experimental results show that pulse reverse current contributes to the void-free deposition of microcolumn arrays. During the deposition under forward pulse stage, the thickness of deposited layer in micro cavities via pulse reverse current is more uniform compared with direct current. Meanwhile, the dissolution behavior under reverse pulse stage is greatly determined by the reverse pulse current density. A low reverse pulse current density (1 A/dm2) leads to a slow dissolution at the mouth of micro cavities. In contrast, a high reverse pulse current density (4 A/dm2) contributes to a high electrolyte potential, as well as a rapid dissolution at the mouth of micro cavities, which helps to eliminate void defects. The experimental results exhibit that void-free microcolumn arrays with a high aspect ratio of 5:1 are obtained via pulse reverse current. This study provides a clear understanding on the formation process of void defects in microcolumn arrays via pulse reverse electrodeposition.http://www.sciencedirect.com/science/article/pii/S2238785423006646Pulse reverse currentMicrocolumn arraysElectrodepositionVoid defect |
| spellingShingle | Yanzhuo Dong Bingyan Jiang Jun Qiang Zhigao Ma Dietmar Drummer Lu Zhang Tuning formation process of void defects in microcolumn arrays via pulse reverse electrodeposition Journal of Materials Research and Technology Pulse reverse current Microcolumn arrays Electrodeposition Void defect |
| title | Tuning formation process of void defects in microcolumn arrays via pulse reverse electrodeposition |
| title_full | Tuning formation process of void defects in microcolumn arrays via pulse reverse electrodeposition |
| title_fullStr | Tuning formation process of void defects in microcolumn arrays via pulse reverse electrodeposition |
| title_full_unstemmed | Tuning formation process of void defects in microcolumn arrays via pulse reverse electrodeposition |
| title_short | Tuning formation process of void defects in microcolumn arrays via pulse reverse electrodeposition |
| title_sort | tuning formation process of void defects in microcolumn arrays via pulse reverse electrodeposition |
| topic | Pulse reverse current Microcolumn arrays Electrodeposition Void defect |
| url | http://www.sciencedirect.com/science/article/pii/S2238785423006646 |
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