Tuning formation process of void defects in microcolumn arrays via pulse reverse electrodeposition
The pulse reverse current electrodeposition process consists of two stages: the forward deposition and reverse dissolution. This study aims to understand the characteristics of forward deposition and reverse dissolution and to reveal their influences on the formation of void defects in electrodeposi...
Main Authors: | Yanzhuo Dong, Bingyan Jiang, Jun Qiang, Zhigao Ma, Dietmar Drummer, Lu Zhang |
---|---|
Format: | Article |
Language: | English |
Published: |
Elsevier
2023-05-01
|
Series: | Journal of Materials Research and Technology |
Subjects: | |
Online Access: | http://www.sciencedirect.com/science/article/pii/S2238785423006646 |
Similar Items
-
Effect of Ion Mass Transfer and Electric Field Distribution on the Formation of Void Defect in Electroformed Nickel Microcolumns
by: Bingyan JIANG, et al.
Published: (2023-08-01) -
Removal of acetylsalicylic acid (ASA) in packed microcolumns with carbon xerogel modified with TiO2 nanoparticles
by: Viviana Eloisa Gomez Rengifo, et al.
Published: (2019-05-01) -
Effect of sulfuric acid concentration on the quality of copper microcolumns in localized electrochemical deposition
by: Qixin Qing, et al.
Published: (2020-01-01) -
Assessment on the microhardness and corrosion resistance characteristics of Ni-SiC and Ni-MWCNT coatings by pulse reverse electrodeposition technique
by: J S ShathishKumar, et al.
Published: (2020-01-01) -
Strategies to Achieve High Strength and Ductility of Pulsed Electrodeposited Nanocrystalline Co-Cu by Tuning the Deposition Parameters
by: Killang Pratama, et al.
Published: (2020-11-01)