Mechanical Properties and Microstructure of Binary In-Sn Alloys for Flexible Low Temperature Electronic Joints
This research evaluates the mechanical properties of a variety of binary In-Sn alloys as potential candidates for low temperature electronic joints. The tensile and hardness tests of as-cast In-5Sn, In-12.5Sn, In-25Sn, In-30Sn, In-35Sn, In-40Sn, In-50Sn, In-60Sn, In-80Sn (wt.%) were assessed at room...
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| Format: | Article |
| Language: | English |
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MDPI AG
2022-11-01
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| Series: | Materials |
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| Online Access: | https://www.mdpi.com/1996-1944/15/23/8321 |
| _version_ | 1797462869214756864 |
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| author | Jiye Zhou Xin Fu Tan Stuart D. McDonald Kazuhiro Nogita |
| author_facet | Jiye Zhou Xin Fu Tan Stuart D. McDonald Kazuhiro Nogita |
| author_sort | Jiye Zhou |
| collection | DOAJ |
| description | This research evaluates the mechanical properties of a variety of binary In-Sn alloys as potential candidates for low temperature electronic joints. The tensile and hardness tests of as-cast In-5Sn, In-12.5Sn, In-25Sn, In-30Sn, In-35Sn, In-40Sn, In-50Sn, In-60Sn, In-80Sn (wt.%) were assessed at room temperature and compared to those of pure In and Sn. The ultimate tensile strength (UTS) increased from 4.2 MPa to 37.8 MPa with increasing tin content in the alloys under the testing condition of 18 mm/min and the results showed little difference under a lower strain rate (1.8 mm/min). Most compositions showed good ductility in tensile testing with an average of 40% elongation. A melting point range of 119.3 °C to 194.9 °C for tested alloys was measured using differential scanning calorimetry (DSC). The microstructure investigated by scanning electron microscopy (SEM) was discussed with respect to the mechanical properties and it has been found that the presence of the Sn-rich γ-InSn<sub>4</sub> phase in the microstructure has a significant impact on mechanical properties. The fundamental data from this study can be used for the development of new low temperature In-Sn alloys. |
| first_indexed | 2024-03-09T17:42:38Z |
| format | Article |
| id | doaj.art-71169e934be541ad97c261dc01f8316f |
| institution | Directory Open Access Journal |
| issn | 1996-1944 |
| language | English |
| last_indexed | 2024-03-09T17:42:38Z |
| publishDate | 2022-11-01 |
| publisher | MDPI AG |
| record_format | Article |
| series | Materials |
| spelling | doaj.art-71169e934be541ad97c261dc01f8316f2023-11-24T11:26:16ZengMDPI AGMaterials1996-19442022-11-011523832110.3390/ma15238321Mechanical Properties and Microstructure of Binary In-Sn Alloys for Flexible Low Temperature Electronic JointsJiye Zhou0Xin Fu Tan1Stuart D. McDonald2Kazuhiro Nogita3Nihon Superior Centre for the Manufacture of Electronic Materials (NS CMEM), School of Mechanical and Mining Engineering, The University of Queensland, St. Lucia, QLD 4072, AustraliaNihon Superior Centre for the Manufacture of Electronic Materials (NS CMEM), School of Mechanical and Mining Engineering, The University of Queensland, St. Lucia, QLD 4072, AustraliaNihon Superior Centre for the Manufacture of Electronic Materials (NS CMEM), School of Mechanical and Mining Engineering, The University of Queensland, St. Lucia, QLD 4072, AustraliaNihon Superior Centre for the Manufacture of Electronic Materials (NS CMEM), School of Mechanical and Mining Engineering, The University of Queensland, St. Lucia, QLD 4072, AustraliaThis research evaluates the mechanical properties of a variety of binary In-Sn alloys as potential candidates for low temperature electronic joints. The tensile and hardness tests of as-cast In-5Sn, In-12.5Sn, In-25Sn, In-30Sn, In-35Sn, In-40Sn, In-50Sn, In-60Sn, In-80Sn (wt.%) were assessed at room temperature and compared to those of pure In and Sn. The ultimate tensile strength (UTS) increased from 4.2 MPa to 37.8 MPa with increasing tin content in the alloys under the testing condition of 18 mm/min and the results showed little difference under a lower strain rate (1.8 mm/min). Most compositions showed good ductility in tensile testing with an average of 40% elongation. A melting point range of 119.3 °C to 194.9 °C for tested alloys was measured using differential scanning calorimetry (DSC). The microstructure investigated by scanning electron microscopy (SEM) was discussed with respect to the mechanical properties and it has been found that the presence of the Sn-rich γ-InSn<sub>4</sub> phase in the microstructure has a significant impact on mechanical properties. The fundamental data from this study can be used for the development of new low temperature In-Sn alloys.https://www.mdpi.com/1996-1944/15/23/8321lead-free soldermechanical propertieslow temperature electronic joints |
| spellingShingle | Jiye Zhou Xin Fu Tan Stuart D. McDonald Kazuhiro Nogita Mechanical Properties and Microstructure of Binary In-Sn Alloys for Flexible Low Temperature Electronic Joints Materials lead-free solder mechanical properties low temperature electronic joints |
| title | Mechanical Properties and Microstructure of Binary In-Sn Alloys for Flexible Low Temperature Electronic Joints |
| title_full | Mechanical Properties and Microstructure of Binary In-Sn Alloys for Flexible Low Temperature Electronic Joints |
| title_fullStr | Mechanical Properties and Microstructure of Binary In-Sn Alloys for Flexible Low Temperature Electronic Joints |
| title_full_unstemmed | Mechanical Properties and Microstructure of Binary In-Sn Alloys for Flexible Low Temperature Electronic Joints |
| title_short | Mechanical Properties and Microstructure of Binary In-Sn Alloys for Flexible Low Temperature Electronic Joints |
| title_sort | mechanical properties and microstructure of binary in sn alloys for flexible low temperature electronic joints |
| topic | lead-free solder mechanical properties low temperature electronic joints |
| url | https://www.mdpi.com/1996-1944/15/23/8321 |
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