Mechanical Properties and Microstructure of Binary In-Sn Alloys for Flexible Low Temperature Electronic Joints

Mechanical Properties and Microstructure of Binary In-Sn Alloys for Flexible Low Temperature Electronic Joints

This research evaluates the mechanical properties of a variety of binary In-Sn alloys as potential candidates for low temperature electronic joints. The tensile and hardness tests of as-cast In-5Sn, In-12.5Sn, In-25Sn, In-30Sn, In-35Sn, In-40Sn, In-50Sn, In-60Sn, In-80Sn (wt.%) were assessed at room...

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Bibliographic Details
Main Authors: Jiye Zhou, Xin Fu Tan, Stuart D. McDonald, Kazuhiro Nogita
Format: Article
Language:English
Published: MDPI AG 2022-11-01
Series:Materials
Subjects:
lead-free solder
mechanical properties
low temperature electronic joints
Online Access:https://www.mdpi.com/1996-1944/15/23/8321

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