Non-Destructive Testing for Winding Insulation Diagnosis Using Inter-Turn Transient Voltage Signature Analysis
The paper proposes a novel approach to assess the integrity of Electrical Insulation Systems (EIS) by evaluating the response of the Transient Voltage Signature Analysis (VSA) to voltage source inverters correlated with changes in the Insulation Capacitance (IC). The involved model structures are de...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2018-05-01
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| Series: | Machines |
| Subjects: | |
| Online Access: | http://www.mdpi.com/2075-1702/6/2/21 |