Mold resistance of bamboo treated with copper complexes-grafted silica gel and its microdistribution in treated bamboo

Abstract Bamboo is readily discolored by mold fungi, which greatly limits its applications. An effective antifungal agent, copper(II) chloride (CuCl2)-grafted silica gel, was prepared by a sol–gel process using tetraethoxysilane (TEOS)/3-aminopropyltriethoxysilane (APTES) mixtures. The elemental com...

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Main Authors: Shoulu Yang, Sha Luo, Anxiang Huang, Yang Luo, Dan Li, Yiqiang Wu, Ning Ji
Format: Article
Language:English
Published: SpringerOpen 2019-11-01
Series:Journal of Wood Science
Subjects:
Online Access:https://doi.org/10.1186/s10086-019-1839-8
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author Shoulu Yang
Sha Luo
Anxiang Huang
Yang Luo
Dan Li
Yiqiang Wu
Ning Ji
author_facet Shoulu Yang
Sha Luo
Anxiang Huang
Yang Luo
Dan Li
Yiqiang Wu
Ning Ji
author_sort Shoulu Yang
collection DOAJ
description Abstract Bamboo is readily discolored by mold fungi, which greatly limits its applications. An effective antifungal agent, copper(II) chloride (CuCl2)-grafted silica gel, was prepared by a sol–gel process using tetraethoxysilane (TEOS)/3-aminopropyltriethoxysilane (APTES) mixtures. The elemental composition and the chemical combinations of homogeneous sol mixture (HSM) and bamboo were determined via Fourier transform infrared (FTIR) spectroscopy and scanning electron microscopy with energy-dispersive X-ray spectrometry (SEM–EDS). The mold resistance of bamboo treated with HSM, alkaline copper quat (ACQ), chromated copper arsenate (CCA), and purified water was characterized by an indoor mold test. The micro-morphology of bamboo treated with HSM was investigated using scanning electron microscopy (SEM). HSM penetrated into the bamboo vessels, and formed xerogels, which was able to coordinate copper(II) cations. SEM–EDS investigations suggest that Si–O–Cu linkages may be formed through an exchange reaction between silanol groups and copper complexes. The bamboo samples treated with HSM showed highly efficient mold resistance due to a good penetration of HSM. Furthermore, no fungal hyphae were found in the structure of HSM-treated bamboo after a 5-week mold test. The copper complexes grafted to silica gel developed in this work provide an efficient antifungal agent for a wide range of potential applications in bamboo protection.
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spelling doaj.art-71cbb511e8144366bffb8fb7e6d38b3b2022-12-21T22:57:28ZengSpringerOpenJournal of Wood Science1435-02111611-46632019-11-016511810.1186/s10086-019-1839-8Mold resistance of bamboo treated with copper complexes-grafted silica gel and its microdistribution in treated bambooShoulu Yang0Sha Luo1Anxiang Huang2Yang Luo3Dan Li4Yiqiang Wu5Ning Ji6School of Materials Science & Engineering, Central South University of Forestry & TechnologySchool of Materials Science & Engineering, Central South University of Forestry & TechnologyGuizhou Academy of ForestryGuizhou Academy of ForestryGuizhou Academy of ForestrySchool of Materials Science & Engineering, Central South University of Forestry & TechnologyGuizhou Academy of ForestryAbstract Bamboo is readily discolored by mold fungi, which greatly limits its applications. An effective antifungal agent, copper(II) chloride (CuCl2)-grafted silica gel, was prepared by a sol–gel process using tetraethoxysilane (TEOS)/3-aminopropyltriethoxysilane (APTES) mixtures. The elemental composition and the chemical combinations of homogeneous sol mixture (HSM) and bamboo were determined via Fourier transform infrared (FTIR) spectroscopy and scanning electron microscopy with energy-dispersive X-ray spectrometry (SEM–EDS). The mold resistance of bamboo treated with HSM, alkaline copper quat (ACQ), chromated copper arsenate (CCA), and purified water was characterized by an indoor mold test. The micro-morphology of bamboo treated with HSM was investigated using scanning electron microscopy (SEM). HSM penetrated into the bamboo vessels, and formed xerogels, which was able to coordinate copper(II) cations. SEM–EDS investigations suggest that Si–O–Cu linkages may be formed through an exchange reaction between silanol groups and copper complexes. The bamboo samples treated with HSM showed highly efficient mold resistance due to a good penetration of HSM. Furthermore, no fungal hyphae were found in the structure of HSM-treated bamboo after a 5-week mold test. The copper complexes grafted to silica gel developed in this work provide an efficient antifungal agent for a wide range of potential applications in bamboo protection.https://doi.org/10.1186/s10086-019-1839-8BambooTEOSAPTESHSMMold resistanceMicrodistribution
spellingShingle Shoulu Yang
Sha Luo
Anxiang Huang
Yang Luo
Dan Li
Yiqiang Wu
Ning Ji
Mold resistance of bamboo treated with copper complexes-grafted silica gel and its microdistribution in treated bamboo
Journal of Wood Science
Bamboo
TEOS
APTES
HSM
Mold resistance
Microdistribution
title Mold resistance of bamboo treated with copper complexes-grafted silica gel and its microdistribution in treated bamboo
title_full Mold resistance of bamboo treated with copper complexes-grafted silica gel and its microdistribution in treated bamboo
title_fullStr Mold resistance of bamboo treated with copper complexes-grafted silica gel and its microdistribution in treated bamboo
title_full_unstemmed Mold resistance of bamboo treated with copper complexes-grafted silica gel and its microdistribution in treated bamboo
title_short Mold resistance of bamboo treated with copper complexes-grafted silica gel and its microdistribution in treated bamboo
title_sort mold resistance of bamboo treated with copper complexes grafted silica gel and its microdistribution in treated bamboo
topic Bamboo
TEOS
APTES
HSM
Mold resistance
Microdistribution
url https://doi.org/10.1186/s10086-019-1839-8
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