Investigation of the Microstructure and Properties of Aluminum–Copper Compounds Fabricated by the High-Pressure Die Casting Process
The material combination of aluminum and copper is increasingly coming into focus, especially for electrical contact applications. Investigations of different casting processes show that a significant influence for the formation of a material bond is the thermal impact. For high-pressure die casting...
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| Format: | Article |
| Language: | English |
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MDPI AG
2022-08-01
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| Series: | Metals |
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| Online Access: | https://www.mdpi.com/2075-4701/12/8/1314 |
| _version_ | 1797443498594533376 |
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| author | Nane Nolte Thomas Lukasczyk Bernd Mayer |
| author_facet | Nane Nolte Thomas Lukasczyk Bernd Mayer |
| author_sort | Nane Nolte |
| collection | DOAJ |
| description | The material combination of aluminum and copper is increasingly coming into focus, especially for electrical contact applications. Investigations of different casting processes show that a significant influence for the formation of a material bond is the thermal impact. For high-pressure die casting (HPDC) processes, the impact is quite low, e.g., due to short cycle times. Despite the high efficiency of this technology, currently there are hardly any investigations in this respect. So, the technology was used in this study to produce aluminum–copper compounds and analyze interfacial layers by means of SEM images and EDX measurements. Furthermore, the mechanical and electrical properties of the compounds were determined by means of tensile shear tests and measurements of the electrical conductivity. By modifying specimen geometry, the thermal impact could be increased and, thus, enhanced compound properties were achieved. Overall, compounds of sufficiently high mechanical strength, as well as electrical conductivity, could be produced by HPDC processes, demonstrating the high technical and economic potential of this casting technique. |
| first_indexed | 2024-03-09T12:56:58Z |
| format | Article |
| id | doaj.art-71d1269e9fa24c0486da6886413ce000 |
| institution | Directory Open Access Journal |
| issn | 2075-4701 |
| language | English |
| last_indexed | 2024-03-09T12:56:58Z |
| publishDate | 2022-08-01 |
| publisher | MDPI AG |
| record_format | Article |
| series | Metals |
| spelling | doaj.art-71d1269e9fa24c0486da6886413ce0002023-11-30T21:59:09ZengMDPI AGMetals2075-47012022-08-01128131410.3390/met12081314Investigation of the Microstructure and Properties of Aluminum–Copper Compounds Fabricated by the High-Pressure Die Casting ProcessNane Nolte0Thomas Lukasczyk1Bernd Mayer2Fraunhofer Institute for Manufacturing Technology and Advanced Materials IFAM, Wiener Str. 12, 28359 Bremen, GermanyFraunhofer Institute for Manufacturing Technology and Advanced Materials IFAM, Wiener Str. 12, 28359 Bremen, GermanyFraunhofer Institute for Manufacturing Technology and Advanced Materials IFAM, Wiener Str. 12, 28359 Bremen, GermanyThe material combination of aluminum and copper is increasingly coming into focus, especially for electrical contact applications. Investigations of different casting processes show that a significant influence for the formation of a material bond is the thermal impact. For high-pressure die casting (HPDC) processes, the impact is quite low, e.g., due to short cycle times. Despite the high efficiency of this technology, currently there are hardly any investigations in this respect. So, the technology was used in this study to produce aluminum–copper compounds and analyze interfacial layers by means of SEM images and EDX measurements. Furthermore, the mechanical and electrical properties of the compounds were determined by means of tensile shear tests and measurements of the electrical conductivity. By modifying specimen geometry, the thermal impact could be increased and, thus, enhanced compound properties were achieved. Overall, compounds of sufficiently high mechanical strength, as well as electrical conductivity, could be produced by HPDC processes, demonstrating the high technical and economic potential of this casting technique.https://www.mdpi.com/2075-4701/12/8/1314compound castingintermetalliccomposite castingaluminumcopperelectrical conductivity |
| spellingShingle | Nane Nolte Thomas Lukasczyk Bernd Mayer Investigation of the Microstructure and Properties of Aluminum–Copper Compounds Fabricated by the High-Pressure Die Casting Process Metals compound casting intermetallic composite casting aluminum copper electrical conductivity |
| title | Investigation of the Microstructure and Properties of Aluminum–Copper Compounds Fabricated by the High-Pressure Die Casting Process |
| title_full | Investigation of the Microstructure and Properties of Aluminum–Copper Compounds Fabricated by the High-Pressure Die Casting Process |
| title_fullStr | Investigation of the Microstructure and Properties of Aluminum–Copper Compounds Fabricated by the High-Pressure Die Casting Process |
| title_full_unstemmed | Investigation of the Microstructure and Properties of Aluminum–Copper Compounds Fabricated by the High-Pressure Die Casting Process |
| title_short | Investigation of the Microstructure and Properties of Aluminum–Copper Compounds Fabricated by the High-Pressure Die Casting Process |
| title_sort | investigation of the microstructure and properties of aluminum copper compounds fabricated by the high pressure die casting process |
| topic | compound casting intermetallic composite casting aluminum copper electrical conductivity |
| url | https://www.mdpi.com/2075-4701/12/8/1314 |
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