Assessing tolerances in direct write laser grayscale lithography and reactive ion etching pattern transfer for fabrication of 2.5D Si master molds

Assessing tolerances in direct write laser grayscale lithography and reactive ion etching pattern transfer for fabrication of 2.5D Si master molds

Direct Write Laser (DWL) Grayscale (GS) lithography has gathered attention as a versatile technological solution to fabricate arbitrary and complex 2.5D structures in photoresist (PR). In combination with Reactive Ion Etching (RIE), DWL GS can enable the fabrication of 2.5D micro-structured silicon...

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Bibliographic Details
Main Authors: Joao Cunha, Inês S. Garcia, Joana D. Santos, José Fernandes, Pedro González-Losada, Carlos Silva, João Gaspar, Ana Cortez, Marcos Sampaio, Diogo E. Aguiam
Format: Article
Language:English
Published: Elsevier 2023-06-01
Series:Micro and Nano Engineering
Subjects:
Grayscale lithography
Direct write laser
Pattern transfer
Reactive ion etching
Microlens arrays
Online Access:http://www.sciencedirect.com/science/article/pii/S2590007223000126

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