Localized Induction Heating of Cu-Sn Layers for Rapid Solid-Liquid Interdiffusion Bonding Based on Miniaturized Coils

Localized Induction Heating of Cu-Sn Layers for Rapid Solid-Liquid Interdiffusion Bonding Based on Miniaturized Coils

Considering the demand for low temperature bonding in 3D integration and packaging of microelectronic or micromechanical components, this paper presents the development and application of an innovative inductive heating system using micro coils for rapid Cu-Sn solid-liquid interdiffusion (SLID) bond...

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Bibliographic Details
Main Authors: Christian Hofmann, Maulik Satwara, Martin Kroll, Sushant Panhale, Patrick Rochala, Maik Wiemer, Karla Hiller, Harald Kuhn
Format: Article
Language:English
Published: MDPI AG 2022-08-01
Series:Micromachines
Subjects:
MEMS packaging
low-temperature bonding
selective bonding
SLID bonding
IMC
intermetallic compound
Online Access:https://www.mdpi.com/2072-666X/13/8/1307

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