A High-Density Memory Design Based on Self-Aligned Tunneling Window for Large-Capacity Memory Application

Despite the continuous downscaling of complementary metal–oxide–semiconductor (CMOS) devices, various scenarios of technology have also been proposed toward the shrinking of semiconductor memory. In this paper, a high-density memory (HDM) has been proposed on the basis of band-to-band tunneling (BTB...

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Main Authors: Chen Wang, Xiuli Zhao, Hao Liu, Xin Chao, Hao Zhu, Qingqing Sun
Format: Article
Language:English
Published: MDPI AG 2021-08-01
Series:Electronics
Subjects:
Online Access:https://www.mdpi.com/2079-9292/10/16/1954
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author Chen Wang
Xiuli Zhao
Hao Liu
Xin Chao
Hao Zhu
Qingqing Sun
author_facet Chen Wang
Xiuli Zhao
Hao Liu
Xin Chao
Hao Zhu
Qingqing Sun
author_sort Chen Wang
collection DOAJ
description Despite the continuous downscaling of complementary metal–oxide–semiconductor (CMOS) devices, various scenarios of technology have also been proposed toward the shrinking of semiconductor memory. In this paper, a high-density memory (HDM) has been proposed on the basis of band-to-band tunneling (BTBT) for low-power, high density, and high-speed memory applications. The geometric structure and electrical properties have been demonstrated by using TCAD tools. Typical memory operations including read, program, and erase have been designed and performed. High operation speed, lower power consumption, as well as good reliability characteristics have been achieved by simulation, which indicates that the HDM may have potential application value as a novel semiconductor memory device.
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spelling doaj.art-7446e5372b164b97a048167b27e608e32023-11-22T07:25:02ZengMDPI AGElectronics2079-92922021-08-011016195410.3390/electronics10161954A High-Density Memory Design Based on Self-Aligned Tunneling Window for Large-Capacity Memory ApplicationChen Wang0Xiuli Zhao1Hao Liu2Xin Chao3Hao Zhu4Qingqing Sun5School of Microelectronics, Fudan University, Shanghai 200433, ChinaSchool of Microelectronics, Fudan University, Shanghai 200433, ChinaSchool of Microelectronics, Fudan University, Shanghai 200433, ChinaSchool of Microelectronics, Fudan University, Shanghai 200433, ChinaSchool of Microelectronics, Fudan University, Shanghai 200433, ChinaSchool of Microelectronics, Fudan University, Shanghai 200433, ChinaDespite the continuous downscaling of complementary metal–oxide–semiconductor (CMOS) devices, various scenarios of technology have also been proposed toward the shrinking of semiconductor memory. In this paper, a high-density memory (HDM) has been proposed on the basis of band-to-band tunneling (BTBT) for low-power, high density, and high-speed memory applications. The geometric structure and electrical properties have been demonstrated by using TCAD tools. Typical memory operations including read, program, and erase have been designed and performed. High operation speed, lower power consumption, as well as good reliability characteristics have been achieved by simulation, which indicates that the HDM may have potential application value as a novel semiconductor memory device.https://www.mdpi.com/2079-9292/10/16/1954high-density memoryband-to-band tunnelinglower powerreliability characteristichigh operation speed
spellingShingle Chen Wang
Xiuli Zhao
Hao Liu
Xin Chao
Hao Zhu
Qingqing Sun
A High-Density Memory Design Based on Self-Aligned Tunneling Window for Large-Capacity Memory Application
Electronics
high-density memory
band-to-band tunneling
lower power
reliability characteristic
high operation speed
title A High-Density Memory Design Based on Self-Aligned Tunneling Window for Large-Capacity Memory Application
title_full A High-Density Memory Design Based on Self-Aligned Tunneling Window for Large-Capacity Memory Application
title_fullStr A High-Density Memory Design Based on Self-Aligned Tunneling Window for Large-Capacity Memory Application
title_full_unstemmed A High-Density Memory Design Based on Self-Aligned Tunneling Window for Large-Capacity Memory Application
title_short A High-Density Memory Design Based on Self-Aligned Tunneling Window for Large-Capacity Memory Application
title_sort high density memory design based on self aligned tunneling window for large capacity memory application
topic high-density memory
band-to-band tunneling
lower power
reliability characteristic
high operation speed
url https://www.mdpi.com/2079-9292/10/16/1954
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