Carbon Nanotube Assembly and Integration for Applications

Abstract Carbon nanotubes (CNTs) have attracted significant interest due to their unique combination of properties including high mechanical strength, large aspect ratios, high surface area, distinct optical characteristics, high thermal and electrical conductivity, which make them suitable for a wi...

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Main Authors: Anusha Venkataraman, Eberechukwu Victoria Amadi, Yingduo Chen, Chris Papadopoulos
Format: Article
Language:English
Published: SpringerOpen 2019-07-01
Series:Nanoscale Research Letters
Subjects:
Online Access:http://link.springer.com/article/10.1186/s11671-019-3046-3
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author Anusha Venkataraman
Eberechukwu Victoria Amadi
Yingduo Chen
Chris Papadopoulos
author_facet Anusha Venkataraman
Eberechukwu Victoria Amadi
Yingduo Chen
Chris Papadopoulos
author_sort Anusha Venkataraman
collection DOAJ
description Abstract Carbon nanotubes (CNTs) have attracted significant interest due to their unique combination of properties including high mechanical strength, large aspect ratios, high surface area, distinct optical characteristics, high thermal and electrical conductivity, which make them suitable for a wide range of applications in areas from electronics (transistors, energy production and storage) to biotechnology (imaging, sensors, actuators and drug delivery) and other applications (displays, photonics, composites and multi-functional coatings/films). Controlled growth, assembly and integration of CNTs is essential for the practical realization of current and future nanotube applications. This review focuses on progress to date in the field of CNT assembly and integration for various applications. CNT synthesis based on arc-discharge, laser ablation and chemical vapor deposition (CVD) including details of tip-growth and base-growth models are first introduced. Advances in CNT structural control (chirality, diameter and junctions) using methods such as catalyst conditioning, cloning, seed-, and template-based growth are then explored in detail, followed by post-growth CNT purification techniques using selective surface chemistry, gel chromatography and density gradient centrifugation. Various assembly and integration techniques for multiple CNTs based on catalyst patterning, forest growth and composites are considered along with their alignment/placement onto different substrates using photolithography, transfer printing and different solution-based techniques such as inkjet printing, dielectrophoresis (DEP) and spin coating. Finally, some of the challenges in current and emerging applications of CNTs in fields such as energy storage, transistors, tissue engineering, drug delivery, electronic cryptographic keys and sensors are considered.
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spelling doaj.art-746edbb7935b44839659b93822ae6e9c2023-09-02T03:23:06ZengSpringerOpenNanoscale Research Letters1931-75731556-276X2019-07-0114114710.1186/s11671-019-3046-3Carbon Nanotube Assembly and Integration for ApplicationsAnusha Venkataraman0Eberechukwu Victoria Amadi1Yingduo Chen2Chris Papadopoulos3Department of Electrical and Computer Engineering, University of VictoriaDepartment of Electrical and Computer Engineering, University of VictoriaDepartment of Electrical and Computer Engineering, University of VictoriaDepartment of Electrical and Computer Engineering, University of VictoriaAbstract Carbon nanotubes (CNTs) have attracted significant interest due to their unique combination of properties including high mechanical strength, large aspect ratios, high surface area, distinct optical characteristics, high thermal and electrical conductivity, which make them suitable for a wide range of applications in areas from electronics (transistors, energy production and storage) to biotechnology (imaging, sensors, actuators and drug delivery) and other applications (displays, photonics, composites and multi-functional coatings/films). Controlled growth, assembly and integration of CNTs is essential for the practical realization of current and future nanotube applications. This review focuses on progress to date in the field of CNT assembly and integration for various applications. CNT synthesis based on arc-discharge, laser ablation and chemical vapor deposition (CVD) including details of tip-growth and base-growth models are first introduced. Advances in CNT structural control (chirality, diameter and junctions) using methods such as catalyst conditioning, cloning, seed-, and template-based growth are then explored in detail, followed by post-growth CNT purification techniques using selective surface chemistry, gel chromatography and density gradient centrifugation. Various assembly and integration techniques for multiple CNTs based on catalyst patterning, forest growth and composites are considered along with their alignment/placement onto different substrates using photolithography, transfer printing and different solution-based techniques such as inkjet printing, dielectrophoresis (DEP) and spin coating. Finally, some of the challenges in current and emerging applications of CNTs in fields such as energy storage, transistors, tissue engineering, drug delivery, electronic cryptographic keys and sensors are considered.http://link.springer.com/article/10.1186/s11671-019-3046-3Carbon nanotubesChemical vapor depositionCatalyst patterningSelf-assemblyIntegrationElectronics
spellingShingle Anusha Venkataraman
Eberechukwu Victoria Amadi
Yingduo Chen
Chris Papadopoulos
Carbon Nanotube Assembly and Integration for Applications
Nanoscale Research Letters
Carbon nanotubes
Chemical vapor deposition
Catalyst patterning
Self-assembly
Integration
Electronics
title Carbon Nanotube Assembly and Integration for Applications
title_full Carbon Nanotube Assembly and Integration for Applications
title_fullStr Carbon Nanotube Assembly and Integration for Applications
title_full_unstemmed Carbon Nanotube Assembly and Integration for Applications
title_short Carbon Nanotube Assembly and Integration for Applications
title_sort carbon nanotube assembly and integration for applications
topic Carbon nanotubes
Chemical vapor deposition
Catalyst patterning
Self-assembly
Integration
Electronics
url http://link.springer.com/article/10.1186/s11671-019-3046-3
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