On-Chip Integration of Pressure Plus 2-Axis (X/Z) Acceleration Composite TPMS Sensors with a Single-Sided Bulk-Micromachining Technique
A novel on-chip integration of pressure plus 2-axis (X/Z) acceleration composite sensors for upgraded production of automobile tire pressure monitoring system (TPMS) is proposed, developed, and characterized. Herein, the X-axis accelerometer is with the cantilever beam-mass structure and is used for...
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| Format: | Article |
| Language: | English |
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MDPI AG
2019-07-01
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| Series: | Micromachines |
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| Online Access: | https://www.mdpi.com/2072-666X/10/7/473 |
| _version_ | 1819014340675633152 |
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| author | Jiachou Wang Fang Song |
| author_facet | Jiachou Wang Fang Song |
| author_sort | Jiachou Wang |
| collection | DOAJ |
| description | A novel on-chip integration of pressure plus 2-axis (X/Z) acceleration composite sensors for upgraded production of automobile tire pressure monitoring system (TPMS) is proposed, developed, and characterized. Herein, the X-axis accelerometer is with the cantilever beam-mass structure and is used for automatically identifying and positioning each of the four wheels. The IC-Foundry-Compatible low-cost batch fabrication technique of MIS (i.e., Micro-openings Inter-etch and Sealing) is employed to only fabricate the device from the front side of (111) silicon wafer, without double-sided micromachining, wafer bonding, complex Cavity-SOI (Silicon on Insulator) processing, and expensive SOI-wafer needed. Benefited from the single-wafer front-side fabrication technique on ordinary single-polished wafers, the fabricated composite TPMS sensor has the advantages of a small chip-size of 1.9 mm × 1.9 mm, low cross-talk interference, low-cost, and compatible process with IC-foundries. The fabricated pressure sensors, X-axis accelerometer and Z-axis accelerometer, show linear sensing outputs, with the sensitivities as about 0.102 mV/kPa, 0.132 mV/kPa, and 0.136 mV/kPa, respectively. Fabricated with the low-cost front-side MIS process, the fabricated composite TPMS sensors are promising in automotive electronics and volume production. |
| first_indexed | 2024-12-21T02:14:17Z |
| format | Article |
| id | doaj.art-7576a6654a394731ac66941ffb26c82c |
| institution | Directory Open Access Journal |
| issn | 2072-666X |
| language | English |
| last_indexed | 2024-12-21T02:14:17Z |
| publishDate | 2019-07-01 |
| publisher | MDPI AG |
| record_format | Article |
| series | Micromachines |
| spelling | doaj.art-7576a6654a394731ac66941ffb26c82c2022-12-21T19:19:18ZengMDPI AGMicromachines2072-666X2019-07-0110747310.3390/mi10070473mi10070473On-Chip Integration of Pressure Plus 2-Axis (X/Z) Acceleration Composite TPMS Sensors with a Single-Sided Bulk-Micromachining TechniqueJiachou Wang0Fang Song1State Key Lab of Transducer Technology, Shanghai Institute of Microsystem and Information Technology, Chinese academy of Sciences, Shanghai 200050, ChinaCollege of Mechanical Engineering, Shanghai University of Engineering Science, Shanghai 201620, ChinaA novel on-chip integration of pressure plus 2-axis (X/Z) acceleration composite sensors for upgraded production of automobile tire pressure monitoring system (TPMS) is proposed, developed, and characterized. Herein, the X-axis accelerometer is with the cantilever beam-mass structure and is used for automatically identifying and positioning each of the four wheels. The IC-Foundry-Compatible low-cost batch fabrication technique of MIS (i.e., Micro-openings Inter-etch and Sealing) is employed to only fabricate the device from the front side of (111) silicon wafer, without double-sided micromachining, wafer bonding, complex Cavity-SOI (Silicon on Insulator) processing, and expensive SOI-wafer needed. Benefited from the single-wafer front-side fabrication technique on ordinary single-polished wafers, the fabricated composite TPMS sensor has the advantages of a small chip-size of 1.9 mm × 1.9 mm, low cross-talk interference, low-cost, and compatible process with IC-foundries. The fabricated pressure sensors, X-axis accelerometer and Z-axis accelerometer, show linear sensing outputs, with the sensitivities as about 0.102 mV/kPa, 0.132 mV/kPa, and 0.136 mV/kPa, respectively. Fabricated with the low-cost front-side MIS process, the fabricated composite TPMS sensors are promising in automotive electronics and volume production.https://www.mdpi.com/2072-666X/10/7/473two-axis (X/Z) accelerometerpressure sensortire pressure monitoring system (TPMS)on-chip integrationsingle-side bulk-micromachining process |
| spellingShingle | Jiachou Wang Fang Song On-Chip Integration of Pressure Plus 2-Axis (X/Z) Acceleration Composite TPMS Sensors with a Single-Sided Bulk-Micromachining Technique Micromachines two-axis (X/Z) accelerometer pressure sensor tire pressure monitoring system (TPMS) on-chip integration single-side bulk-micromachining process |
| title | On-Chip Integration of Pressure Plus 2-Axis (X/Z) Acceleration Composite TPMS Sensors with a Single-Sided Bulk-Micromachining Technique |
| title_full | On-Chip Integration of Pressure Plus 2-Axis (X/Z) Acceleration Composite TPMS Sensors with a Single-Sided Bulk-Micromachining Technique |
| title_fullStr | On-Chip Integration of Pressure Plus 2-Axis (X/Z) Acceleration Composite TPMS Sensors with a Single-Sided Bulk-Micromachining Technique |
| title_full_unstemmed | On-Chip Integration of Pressure Plus 2-Axis (X/Z) Acceleration Composite TPMS Sensors with a Single-Sided Bulk-Micromachining Technique |
| title_short | On-Chip Integration of Pressure Plus 2-Axis (X/Z) Acceleration Composite TPMS Sensors with a Single-Sided Bulk-Micromachining Technique |
| title_sort | on chip integration of pressure plus 2 axis x z acceleration composite tpms sensors with a single sided bulk micromachining technique |
| topic | two-axis (X/Z) accelerometer pressure sensor tire pressure monitoring system (TPMS) on-chip integration single-side bulk-micromachining process |
| url | https://www.mdpi.com/2072-666X/10/7/473 |
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