An analytical model for predicting residual stresses in multiple layers by plasma cladding process

An analytical model is developed to predict residual stresses formed during plasma cladding process. This is based on the force and moment balances and misfit strain caused by differential coefficient of thermal expansion (CTE) of substrate and cladding layers during cooling. The model can be implem...

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Bibliographic Details
Main Authors: Yajie Chu, Benxing Hao, Zhenhong Li, Jun Zhu, Xiunan He
Format: Article
Language:English
Published: AIP Publishing LLC 2019-08-01
Series:AIP Advances
Online Access:http://dx.doi.org/10.1063/1.5115559