Investigation on SMT Product Defect Recognition Based on Multi-Source and Multi-Dimensional Data Reconstruction
The recognition of defects in the solder paste printing process significantly influences the surface-mounted technology (SMT) production quality. However, defect recognition via inspection by a machine has poor accuracy, resulting in a need for the manual rechecking of many defects and a high produc...
| Main Authors: | , , , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2022-05-01
|
| Series: | Micromachines |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2072-666X/13/6/860 |