Physico-chemical Processes at the Interface of Heterostructures Ag-Pd – Sn-Pb

Physicochemical processes taking place at the interface of film elements (conductors) of hybrid integrated circuits, thick-film sensors and other microelectronic devices (MED) based on silver-palladium pastes and elements of standard soldering materials have been studied. Physicochemical mechanisms...

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Bibliographic Details
Main Authors: Ya.I. Lepikh, T.I. Lavrenova, P.O. Snigur
Format: Article
Language:English
Published: Vasyl Stefanyk Precarpathian National University 2021-08-01
Series:Фізика і хімія твердого тіла
Subjects:
Online Access:https://journals.pnu.edu.ua/index.php/pcss/article/view/5122
Description
Summary:Physicochemical processes taking place at the interface of film elements (conductors) of hybrid integrated circuits, thick-film sensors and other microelectronic devices (MED) based on silver-palladium pastes and elements of standard soldering materials have been studied. Physicochemical mechanisms of processes of the material element mutual dissolution at the interface are proposed and analyzed. Conclusions are made that these processes affect the degradation of the electrophysical parameters and contact switch connections operational characteristics. It is established that the degradation main cause (partial or complete destruction of the contact connections on substrate ceramics (glass) Ag-Pd – Sn-Pb) is the functional film material significant dissolution in the Sn-Pb melt.
ISSN:1729-4428
2309-8589