Physico-chemical Processes at the Interface of Heterostructures Ag-Pd – Sn-Pb

Physicochemical processes taking place at the interface of film elements (conductors) of hybrid integrated circuits, thick-film sensors and other microelectronic devices (MED) based on silver-palladium pastes and elements of standard soldering materials have been studied. Physicochemical mechanisms...

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Main Authors: Ya.I. Lepikh, T.I. Lavrenova, P.O. Snigur
Format: Article
Language:English
Published: Vasyl Stefanyk Precarpathian National University 2021-08-01
Series:Фізика і хімія твердого тіла
Subjects:
Online Access:https://journals.pnu.edu.ua/index.php/pcss/article/view/5122
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author Ya.I. Lepikh
T.I. Lavrenova
P.O. Snigur
author_facet Ya.I. Lepikh
T.I. Lavrenova
P.O. Snigur
author_sort Ya.I. Lepikh
collection DOAJ
description Physicochemical processes taking place at the interface of film elements (conductors) of hybrid integrated circuits, thick-film sensors and other microelectronic devices (MED) based on silver-palladium pastes and elements of standard soldering materials have been studied. Physicochemical mechanisms of processes of the material element mutual dissolution at the interface are proposed and analyzed. Conclusions are made that these processes affect the degradation of the electrophysical parameters and contact switch connections operational characteristics. It is established that the degradation main cause (partial or complete destruction of the contact connections on substrate ceramics (glass) Ag-Pd – Sn-Pb) is the functional film material significant dissolution in the Sn-Pb melt.
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spelling doaj.art-75d37d7721874a98aee48d08b3a91d2a2022-12-22T00:15:00ZengVasyl Stefanyk Precarpathian National UniversityФізика і хімія твердого тіла1729-44282309-85892021-08-0122347748010.15330/pcss.22.3.477-4805122Physico-chemical Processes at the Interface of Heterostructures Ag-Pd – Sn-PbYa.I. Lepikh0T.I. Lavrenova1P.O. Snigur2Odesa I.I. Mechnikov National UniversityOdesa I.I. Mechnikov National UniversityOdesa I.I. Mechnikov National UniversityPhysicochemical processes taking place at the interface of film elements (conductors) of hybrid integrated circuits, thick-film sensors and other microelectronic devices (MED) based on silver-palladium pastes and elements of standard soldering materials have been studied. Physicochemical mechanisms of processes of the material element mutual dissolution at the interface are proposed and analyzed. Conclusions are made that these processes affect the degradation of the electrophysical parameters and contact switch connections operational characteristics. It is established that the degradation main cause (partial or complete destruction of the contact connections on substrate ceramics (glass) Ag-Pd – Sn-Pb) is the functional film material significant dissolution in the Sn-Pb melt.https://journals.pnu.edu.ua/index.php/pcss/article/view/5122interface boundaries of heterostructuresphysicochemical processes
spellingShingle Ya.I. Lepikh
T.I. Lavrenova
P.O. Snigur
Physico-chemical Processes at the Interface of Heterostructures Ag-Pd – Sn-Pb
Фізика і хімія твердого тіла
interface boundaries of heterostructures
physicochemical processes
title Physico-chemical Processes at the Interface of Heterostructures Ag-Pd – Sn-Pb
title_full Physico-chemical Processes at the Interface of Heterostructures Ag-Pd – Sn-Pb
title_fullStr Physico-chemical Processes at the Interface of Heterostructures Ag-Pd – Sn-Pb
title_full_unstemmed Physico-chemical Processes at the Interface of Heterostructures Ag-Pd – Sn-Pb
title_short Physico-chemical Processes at the Interface of Heterostructures Ag-Pd – Sn-Pb
title_sort physico chemical processes at the interface of heterostructures ag pd sn pb
topic interface boundaries of heterostructures
physicochemical processes
url https://journals.pnu.edu.ua/index.php/pcss/article/view/5122
work_keys_str_mv AT yailepikh physicochemicalprocessesattheinterfaceofheterostructuresagpdsnpb
AT tilavrenova physicochemicalprocessesattheinterfaceofheterostructuresagpdsnpb
AT posnigur physicochemicalprocessesattheinterfaceofheterostructuresagpdsnpb