Effect of Current Density on Quality of Electroformed Mold Inserts with Micro/Nano-cavities
Based on the COMSOL Multiphysics software, the electric field distribution and the growth front of electroformed layer on the cathode surface were simulated during the electroforming process. The simulation results show that the uniformity of electroformed layer with micro/nano-cavities can be effec...
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Journal of Materials Engineering
2017-10-01
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Series: | Cailiao gongcheng |
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Online Access: | http://jme.biam.ac.cn/CN/Y2017/V45/I10/52 |
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author | WENG Can WANG Fei YANG Dong-jiao LYU Hui JIANG Bing-yan |
author_facet | WENG Can WANG Fei YANG Dong-jiao LYU Hui JIANG Bing-yan |
author_sort | WENG Can |
collection | DOAJ |
description | Based on the COMSOL Multiphysics software, the electric field distribution and the growth front of electroformed layer on the cathode surface were simulated during the electroforming process. The simulation results show that the uniformity of electroformed layer with micro/nano-cavities can be effectively improved with a better replication quality by using a lower initial current density. Both nano-diaphragm and nanopillar array are selected as masters for the electroforming experiments. When the initial current density decreases from 4A/dm<sup>2</sup> to 1A/dm<sup>2</sup>, the maximum deviation of characteristic width between the nano-diaphragm master and mold inserts dramatically decreases from 60nm to ±20nm. By setting proper current density and enhancing mass transfer near the cathode surface, the characteristic diameter dimension error of electroformed mold inserts for nanopillar array decreases from 6.27% to 2.49%. The replication quality of electroformed mold inserts with micro/nano-cavities can be significantly improved by these methods. |
first_indexed | 2024-04-11T02:12:57Z |
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id | doaj.art-75e1f40f865c4dad9362cd96fb3deff3 |
institution | Directory Open Access Journal |
issn | 1001-4381 1001-4381 |
language | zho |
last_indexed | 2024-04-11T02:12:57Z |
publishDate | 2017-10-01 |
publisher | Journal of Materials Engineering |
record_format | Article |
series | Cailiao gongcheng |
spelling | doaj.art-75e1f40f865c4dad9362cd96fb3deff32023-01-03T01:48:57ZzhoJournal of Materials EngineeringCailiao gongcheng1001-43811001-43812017-10-014510525810.11868/j.issn.1001-4381.2016.000104201710000104Effect of Current Density on Quality of Electroformed Mold Inserts with Micro/Nano-cavitiesWENG Can0WANG Fei1YANG Dong-jiao2LYU Hui3JIANG Bing-yan4State Key Laboratory of High Performance Complex Manufacturing, Central South University, Changsha 410083, ChinaState Key Laboratory of High Performance Complex Manufacturing, Central South University, Changsha 410083, ChinaState Key Laboratory of High Performance Complex Manufacturing, Central South University, Changsha 410083, ChinaState Key Laboratory of High Performance Complex Manufacturing, Central South University, Changsha 410083, ChinaState Key Laboratory of High Performance Complex Manufacturing, Central South University, Changsha 410083, ChinaBased on the COMSOL Multiphysics software, the electric field distribution and the growth front of electroformed layer on the cathode surface were simulated during the electroforming process. The simulation results show that the uniformity of electroformed layer with micro/nano-cavities can be effectively improved with a better replication quality by using a lower initial current density. Both nano-diaphragm and nanopillar array are selected as masters for the electroforming experiments. When the initial current density decreases from 4A/dm<sup>2</sup> to 1A/dm<sup>2</sup>, the maximum deviation of characteristic width between the nano-diaphragm master and mold inserts dramatically decreases from 60nm to ±20nm. By setting proper current density and enhancing mass transfer near the cathode surface, the characteristic diameter dimension error of electroformed mold inserts for nanopillar array decreases from 6.27% to 2.49%. The replication quality of electroformed mold inserts with micro/nano-cavities can be significantly improved by these methods.http://jme.biam.ac.cn/CN/Y2017/V45/I10/52micro/nano structureelectroformingcurrent densitymold insert |
spellingShingle | WENG Can WANG Fei YANG Dong-jiao LYU Hui JIANG Bing-yan Effect of Current Density on Quality of Electroformed Mold Inserts with Micro/Nano-cavities Cailiao gongcheng micro/nano structure electroforming current density mold insert |
title | Effect of Current Density on Quality of Electroformed Mold Inserts with Micro/Nano-cavities |
title_full | Effect of Current Density on Quality of Electroformed Mold Inserts with Micro/Nano-cavities |
title_fullStr | Effect of Current Density on Quality of Electroformed Mold Inserts with Micro/Nano-cavities |
title_full_unstemmed | Effect of Current Density on Quality of Electroformed Mold Inserts with Micro/Nano-cavities |
title_short | Effect of Current Density on Quality of Electroformed Mold Inserts with Micro/Nano-cavities |
title_sort | effect of current density on quality of electroformed mold inserts with micro nano cavities |
topic | micro/nano structure electroforming current density mold insert |
url | http://jme.biam.ac.cn/CN/Y2017/V45/I10/52 |
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