Recent Advances on Thermal Management of Flexible Inorganic Electronics
Flexible inorganic electronic devices (FIEDs) consisting of functional inorganic components on a soft polymer substrate have enabled many novel applications such as epidermal electronics and wearable electronics, which cannot be realized through conventional rigid electronics. The low thermal dissip...
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| Format: | Article |
| Language: | English |
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MDPI AG
2020-04-01
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| Series: | Micromachines |
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| Online Access: | https://www.mdpi.com/2072-666X/11/4/390 |
| _version_ | 1797571130000670720 |
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| author | Yuhang Li Jiayun Chen Shuang Zhao Jizhou Song |
| author_facet | Yuhang Li Jiayun Chen Shuang Zhao Jizhou Song |
| author_sort | Yuhang Li |
| collection | DOAJ |
| description | Flexible inorganic electronic devices (FIEDs) consisting of functional inorganic components on a soft polymer substrate have enabled many novel applications such as epidermal electronics and wearable electronics, which cannot be realized through conventional rigid electronics. The low thermal dissipation capacity of the soft polymer substrate of FIEDs demands proper thermal management to reduce the undesired thermal influences. The biointegrated applications of FIEDs pose even more stringent requirements on thermal management due to the sensitive nature of biological tissues to temperature. In this review, we take microscale inorganic light-emitting diodes (μ-ILEDs) as an example of functional components to summarize the recent advances on thermal management of FIEDs including thermal analysis, thermo-mechanical analysis and thermal designs of FIEDs with and without biological tissues. These results are very helpful to understand the underlying heat transfer mechanism and provide design guidelines to optimize FIEDs in practical applications. |
| first_indexed | 2024-03-10T20:35:14Z |
| format | Article |
| id | doaj.art-767e502c1e204d9698d417ae97001c13 |
| institution | Directory Open Access Journal |
| issn | 2072-666X |
| language | English |
| last_indexed | 2024-03-10T20:35:14Z |
| publishDate | 2020-04-01 |
| publisher | MDPI AG |
| record_format | Article |
| series | Micromachines |
| spelling | doaj.art-767e502c1e204d9698d417ae97001c132023-11-19T21:04:37ZengMDPI AGMicromachines2072-666X2020-04-0111439010.3390/mi11040390Recent Advances on Thermal Management of Flexible Inorganic ElectronicsYuhang Li0Jiayun Chen1Shuang Zhao2Jizhou Song3Institute of Solid Mechanics, Beihang University (BUAA), Beijing 100191, ChinaInstitute of Solid Mechanics, Beihang University (BUAA), Beijing 100191, ChinaInstitute of Structure and Environment Engineering, Beijing 100076, ChinaDepartment of Engineering Mechanics, Soft Matter Research Center, and Key Laboratory of Soft Machines and Smart Devices of Zhejiang Province, Zhejiang University, Hangzhou 310027, ChinaFlexible inorganic electronic devices (FIEDs) consisting of functional inorganic components on a soft polymer substrate have enabled many novel applications such as epidermal electronics and wearable electronics, which cannot be realized through conventional rigid electronics. The low thermal dissipation capacity of the soft polymer substrate of FIEDs demands proper thermal management to reduce the undesired thermal influences. The biointegrated applications of FIEDs pose even more stringent requirements on thermal management due to the sensitive nature of biological tissues to temperature. In this review, we take microscale inorganic light-emitting diodes (μ-ILEDs) as an example of functional components to summarize the recent advances on thermal management of FIEDs including thermal analysis, thermo-mechanical analysis and thermal designs of FIEDs with and without biological tissues. These results are very helpful to understand the underlying heat transfer mechanism and provide design guidelines to optimize FIEDs in practical applications.https://www.mdpi.com/2072-666X/11/4/390flexible inorganic electronicsthermal managementepidermismicroscale inorganic light-emitting diodes |
| spellingShingle | Yuhang Li Jiayun Chen Shuang Zhao Jizhou Song Recent Advances on Thermal Management of Flexible Inorganic Electronics Micromachines flexible inorganic electronics thermal management epidermis microscale inorganic light-emitting diodes |
| title | Recent Advances on Thermal Management of Flexible Inorganic Electronics |
| title_full | Recent Advances on Thermal Management of Flexible Inorganic Electronics |
| title_fullStr | Recent Advances on Thermal Management of Flexible Inorganic Electronics |
| title_full_unstemmed | Recent Advances on Thermal Management of Flexible Inorganic Electronics |
| title_short | Recent Advances on Thermal Management of Flexible Inorganic Electronics |
| title_sort | recent advances on thermal management of flexible inorganic electronics |
| topic | flexible inorganic electronics thermal management epidermis microscale inorganic light-emitting diodes |
| url | https://www.mdpi.com/2072-666X/11/4/390 |
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