Preparation of SiO2 particles with silicone-methoxy groups on surface and its co-curing hydroxyl silicone oil

SiO _2 particles were modified by γ -aminopropyltriethoxy silane (KH550) and γ -(2,3-epoxypropoxy)propyltrimethoxy silane (KH560) in sequence to prepare SiO _2 particles with silicone-methoxy groups on surface (SiO _2 -s-Si(OCH _3 ) _3 ). X-ray photoelectron spectroscopy (XPS) and thermal gravimetri...

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Bibliographic Details
Main Authors: Ran Zhou, Haihong Ma, Zhengfa Zhou, Weibing Xu, Fengmei Ren, Chunhui Li
Format: Article
Language:English
Published: IOP Publishing 2020-01-01
Series:Materials Research Express
Subjects:
Online Access:https://doi.org/10.1088/2053-1591/ab9bc6
Description
Summary:SiO _2 particles were modified by γ -aminopropyltriethoxy silane (KH550) and γ -(2,3-epoxypropoxy)propyltrimethoxy silane (KH560) in sequence to prepare SiO _2 particles with silicone-methoxy groups on surface (SiO _2 -s-Si(OCH _3 ) _3 ). X-ray photoelectron spectroscopy (XPS) and thermal gravimetric analysis (TGA) were used to characterize the modified SiO _2 particles. The SiO _2 -s-Si(OCH _3 ) _3 particles and tetramethoxysilane were used to co-cure hydroxyl silicone oil. The strong interfacial interactions between silicone rubber and fillers, which came from hydrolyzed SiO _2 -s-Si(OCH _3 ) _3 particles in situ reacting with hydroxyl silicone oil, had a great effect on the properties of composites. The mechanical properties, thermal conductivity, dielectric strength and volume resistivity of SiO _2 -s-Si(OCH _3 ) _3 /silicone rubber composites were considerably higher than that of pristine SiO _2 /silicone rubber composites at the same content of SiO _2 , while the dielectric constant and dielectric loss tangent of SiO _2 -s-Si(OCH _3 ) _3 /silicone rubber composites was lower than that of pristine SiO _2 /silicone rubber composites at the same content of SiO _2 .
ISSN:2053-1591