Microstructure and Properties of the Copper Alloyed with Ag and Ti Powders Using Fiber Laser

The scope of the work covers the development of the relationship between the chemical composition of surface-modified copper and the diffusion of alloy elements as well as the microstructure and mechanical properties. This article presents the impact of laser alloying with titanium and silver powder...

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Bibliographic Details
Main Authors: Mariusz Krupiński, Paulina Ewelina Smolarczyk, Mirosław Bonek
Format: Article
Language:English
Published: MDPI AG 2020-05-01
Series:Materials
Subjects:
Online Access:https://www.mdpi.com/1996-1944/13/11/2430
Description
Summary:The scope of the work covers the development of the relationship between the chemical composition of surface-modified copper and the diffusion of alloy elements as well as the microstructure and mechanical properties. This article presents the impact of laser alloying with titanium and silver powders on the microstructure and mechanical properties of copper. In order to investigate the phenomena occurring during the laser alloying process, microstructural studies were performed using scanning electron microscopy (SEM), optical microscopy, and energy dispersive x-ray spectroscopic (EDS) analysis of the chemical composition in micro-areas. In addition, to test the properties of the resulting alloy, abrasion resistance, hardness measurement at low loading force, and conductivity measurements were performed. As a result of alloying with Ag and Ti powders, three distinct zones were indeed recognized: re-melting zone (RZ), diffusion zone (DZ), and heat affected zone (HAZ). The surface modification that results from laser alloying increases the hardness as well as the abrasion resistance of the material. Overall, it was found that laser alloying with Ti powder increased the strength of the copper surface layer due to the formation of intermetallic phases (Cu<sub>3</sub>Ti<sub>2</sub>). It was also found that laser alloying with Ag powder changed the mechanical properties of the surface layer due to the solid solution strengthening.
ISSN:1996-1944